会議開催最新情報
LAMP2019 第8回レーザ先端材料加工国際会議
LAMP2019 The 8th International Congress on Laser Advanced Materials Processing
第8回レーザ先端材料加工国際会議
LPM2019 - The 20th International Symposium on Laser
Precision Microfabrication
第20回レーザ精密微細加工国際シンポジウム
HPL2019 - The 8th International Symposium on High
Power Laser Processing
第8回高出力レーザ加工国際シンポジウム
Date: May 21-24, 2019
Venue: International Conference Center Hiroshima (広島国際会議場)
Organizer: Japan Laser Processing Society (JLPS)
Website: http://www.jlps.gr.jp/lamp/lamp2019/
Call for Papers: lamp2019_annai.pdf
Early-bird Registration Due Date (Extended) : MARCH 15, 2019, JST
Geneal Chair: Koji Sugioka, RIKEN, Japan
Co-Chairs:
Hiroyuki Niino, AIST, Japan (LPM2019 Program
Committee Chair)
Seiji Katayama, NADEX, Japan (HPL2019 Program
Committee Chair)
Takashi Ishide, Mitsubishi Heavy Industries, Japan (JLPS
President)
Yongfeng Lu, University of Nebraska-Lincoln, USA
Michael Schmidt, Friedrich- Alexander Universität Erlangen-Nürnberg, Germany
Steering Committee Chair: Kenji Shinozaki, Hiroshima University, Japan
テーブルトップ展示・カタログ展示 募集要項: PDF
各種スポンサー募集要項：PDF
Application form for Table-Top Exhibitions and Catalog Display: PDF
Application form for Sponsorship Opportunities: PDF
E-mail: lamp2019(at mark)jlps.gr.jp
