会議開催最新情報

LAMP2019 第8回レーザ先端材料加工国際会議

LAMP2019 The 8th International Congress on Laser Advanced Materials Processing

第8回レーザ先端材料加工国際会議

LPM2019 - The 20th International Symposium on Laser Precision Microfabrication

第20回レーザ精密微細加工国際シンポジウム

HPL2019 - The 8th International Symposium on High Power Laser Processing

第8回高出力レーザ加工国際シンポジウム

Date: May 21-24, 2019

Venue: International Conference Center Hiroshima (広島国際会議場)

Organizer: Japan Laser Processing Society (JLPS)

Website: http://www.jlps.gr.jp/lamp/lamp2019/

Abstract Submission Due Date: January 7th, 2019

General Chair: Koji Sugioka, RIKEN, Japan

Co-Chairs:

Hiroyuki Niino, AIST, Japan (LPM2019 Program Committee Chair)

Seiji Katayama, NADEX, Japan (HPL2019 Program Committee Chair)

Takashi Ishide, Mitsubishi Heavy Industries, Japan (JLPS President)

Yongfeng Lu, University of Nebraska-Lincoln, USA

Michael Schmidt, Friedrich- Alexander Universität Erlangen-Nürnberg, Germany

Steering Committee Chair: Kenji Shinozaki, Hiroshima University, Japan