Venue: Pacifico Yokohama, Yokohama, Japan
Co-located with Optics & Photonics International Congress 2018 (OPIC2018)
Laser beam processing has played an important role in industrial fields of not only macro-products but also micro-products, and its technologies are essential to open the new strategies of smart manufacturing such as highly integrated, accurate, efficient processing with low energy consumption. SLPC2018 deals with science and technology of smart laser materials processing including micro and macro laser processing. SLPC2018 is planned as a three-day event with a plenary session, oral sessions and poster session. The aim of this conference is to provide a forum for discussion of fundamental aspects of laser-matter interaction, the state-of-the-art of smart laser processing, and topics for the next generation with fundamental scientists, end users and laser manufacturers. We expect that SLPC2018 would play an important role not only for understanding fundamental knowledge of laser processing but also forecasting future technologies and the future laser processing fields. During the conference, Optics and Photonics International Exhibition is held jointly at the conference site.
One-Page Digest (Abstract) Due Date :
-> Extended to January 26
Registration Due Date for Presenting Authors
|@ March 5, 2018, JST (Updated)|
Early Registration Due Date
|@ April 5, 2018, JST|
Submission website: Click Here.
Submission Due Date: December 14, 2017, JST ----> Extended to January 26, 2018, JST
Digest must be submitted in pdf format.
Your digest should be written on the Form. Digest should include Paper Title, Author(s), Affiliation, Country and E-mail address of corresponding author followed by text. Digest should be no more than one page, A4 letter size paper (210mm x297mm). A Figure/Table may be included. Please do not exceed the defined margins or length. Please do not use special characters or fonts except Times New Roman and symbol font in your submission form. If it is not possible to use the online style template, please directly contact SLPC2018 Office at "email@example.com".
The guidelines for the abstract submission are available as a download below:
SLPC2018 Digest Template (DOC)
Prof. Dr. Andreas Ostendorf, Ruhr University Bochum, Germany
"Laser processing in flexible electronics"
Prof. Masahiro Tsukamoto, JWRI, Osaka University, Japan
"Blue diode laser development for advanced materials processing"
Mr. Bastian Becker, TRUMPF Corporation, Japan (Session: Digital Production (AM and IoT))
"Latest trends of IoT and additive laser manufacturing"
Dr. Yohei Kobayashi, University of Tokyo, Japan (Session: Digital Production (AM and IoT))
"Toward cool laser manufacturing"
Dr. Markus Kogel-Hollacher, Precitec GmbH & Co. KG, Germany (Session: Cutting and Welding)
"Sensors in laser materials processing: Are they finally ready to take the lead?"
Dr. Jean-Michel Pelaprat, NUBURU, USA (Session: Blue Laser Development and Processing)
"High power blue lasers development for copper material processing"
Mr. Markus Antonius Ruetering, Laserline GmbH, Germany (Session: Industrial Applications)
"Latest diode laser technology and its industrial applications"
Dr. Koji Tojo, Simadzu Corporation, Japan (Session: Blue Laser Development and Processing)
"High brightness blue direct diode laser for advanced materials processing"
April 5, 2018, JST
|After April 6
|Member||JPY 55,000-||JPY 60,000-|
|Student, Retiree||JPY 18,000-||JPY 21,000-|
April 5, 2018, JST
|After April 6
|Non-member||JPY 65,000-||JPY 70,000-|
|Student, Retiree||JPY 21,000-||JPY 23,000-|
|Laser Institute of America (LIA)
|Association of Industrial Laser Users (AILU)|
-- Platinum Level Sponsors --
-- Gold Level Sponsors --
|OSAKA FUJI Corporation
|Y-E DATA, Inc.|