The Third Smart Laser Processing Conference 2018
April 24-26, 2018, Yokohama, Japan

Organized by Japan Laser Processing Society (JLPS)

Venue: Pacifico Yokohama, Yokohama, Japan

Co-located with Optics & Photonics International Congress 2018 (OPIC2018)


Laser beam processing has played an important role in industrial fields of not only macro-products but also micro-products, and its technologies are essential to open the new strategies of smart manufacturing such as highly integrated, accurate, efficient processing with low energy consumption. SLPC2018 deals with science and technology of smart laser materials processing including micro and macro laser processing. SLPC2018 is planned as a three-day event with a plenary session, oral sessions and poster session. The aim of this conference is to provide a forum for discussion of fundamental aspects of laser-matter interaction, the state-of-the-art of smart laser processing, and topics for the next generation with fundamental scientists, end users and laser manufacturers. We expect that SLPC2018 would play an important role not only for understanding fundamental knowledge of laser processing but also forecasting future technologies and the future laser processing fields. During the conference, Optics and Photonics International Exhibition is held jointly at the conference site.



One-Page Digest (Abstract) Due Date :

@ December 14, 2017, JST
-> Extended to January 26

Registration Due Date for Presenting Authors

@ March 5, 2018, JST (Updated)

Early Registration Due Date

@ April 5, 2018, JST


Submission website: Click Here.
Submission Due Date:
December 14, 2017, JST ----> Extended to January 26, 2018, JST

Digest must be submitted in pdf format.
Your digest should be written on the Form. Digest should include Paper Title, Author(s), Affiliation, Country and E-mail address of corresponding author followed by text. Digest should be no more than one page, A4 letter size paper (210mm x297mm). A Figure/Table may be included. Please do not exceed the defined margins or length. Please do not use special characters or fonts except Times New Roman and symbol font in your submission form. If it is not possible to use the online style template, please directly contact SLPC2018 Office at "".

The guidelines for the abstract submission are available as a download below:

SLPC2018 Digest Template (DOC)


Plenary Speakers:

Prof. Dr. Andreas Ostendorf, Ruhr University Bochum, Germany
"Laser processing in flexible electronics"

Prof. Masahiro Tsukamoto, JWRI, Osaka University, Japan
"Blue diode laser development for advanced materials processing"

Invited Speakers:

Mr. Bastian Becker, TRUMPF Corporation, Japan (Session: Digital Production (AM and IoT))
"Latest trends of IoT and additive laser manufacturing"

Dr. Yohei Kobayashi, University of Tokyo, Japan (Session: Digital Production (AM and IoT))
"Toward cool laser manufacturing"

Dr. Markus Kogel-Hollacher, Precitec GmbH & Co. KG, Germany (Session: Cutting and Welding)
"Sensors in laser materials processing: Are they finally ready to take the lead?"

Dr. Jean-Michel Pelaprat, NUBURU, USA (Session: Blue Laser Development and Processing)
"High power blue lasers development for copper material processing"

Mr. Markus Antonius Ruetering, Laserline GmbH, Germany (Session: Industrial Applications)
"Latest diode laser technology and its industrial applications"

Dr. Koji Tojo, Simadzu Corporation, Japan (Session: Blue Laser Development and Processing)
"High brightness blue direct diode laser for advanced materials processing"


Conference Chairs:

Masahiro Tsukamoto, JWRI, Osaka University, Japan
Reinhart Poprawe, Fraunhofer Institute for Laser Technology, Germany

Program Committee:

Yasuhiro Okamoto, Okayama University, Japan

Masahiro Tsukamoto, Osaka University, Japan
Masayuki Fujita, Institute for Laser Technology, Japan
Masaki Hashida, Kyoto University, Japan
Yoshio Hayasaki, Utsunomiya University, Japan
Masahito Katto, University of Miyazaki, Japan
Tetsuya Makimura, University of Tsukuba, Japan
Hitoshi Nakano, Kindai University, Japan
Takahiro Nakamura, Tohoku University, Japan

International Advisory Committee:

Masahiro Tsukamoto, Osaka University, Japan

Chung-Wei Cheng, National Chiao Tung University, Taiwan
Bo Gu, BOS Photonics, USA
Lin Li, The University of Manchester, UK
Yongfeng Lu, University of Nebraska-Lincoln, USA
Beat Neunschwander, Bern University of Applied Sciences, Switzerland
Andreas Ostendorf, Ruhl-University Bochum, Germany
Koji Sugioka, RIKEN, Japan

Steering Committee:

Yuji Sato, Osaka University, Japan

Kunihiko Washio, Paradigm Laser Research Ltd., Japan
Tomokazu Sakagawa, Kataoka Corporation, Japan
Togo Shinonaga, Okayama University, Japan
Shin-Ichiro Masuno, JWRI, Osaka University, Japan


Registration Fees (Member*)

Type Before/on
April 5, 2018, JST
After April 6
Member JPY 55,000- JPY 60,000-
Student, Retiree JPY 18,000- JPY 21,000-
*Member of specialized international conference organizations

Registration Fees (Non-member)

Type Before/on
April 5, 2018, JST
After April 6
Non-member JPY 65,000- JPY 70,000-
Student, Retiree JPY 21,000- JPY 23,000-


Coming soon


VENUE: Pacifico Yokohama (Room 416+417)
1-1-1 Minato Mirai, Nishi-ku, Yokohama 220-0012, Japan


Yokohama city, Kanagawa prefecture, JAPAN. Yokohama city, the center of Kanagawa prefecture is located south of Tokyo. Pacifico Yokohama is conveniently located about 40 min. by Limousine Bus from Haneda Airport and 90 min. from Narita Airport.


Visa support will be given only to those whose papers are accepted for oral/poster presentations after the payment of registration fee.
For the details, please contact SLPC2018 secretary.

For the information on obtaining Visa and entering Japan, please take a look at the following MOFA website:


Hotel & Travel:


Laser Institute of America (LIA)

Association of Industrial Laser Users (AILU)

Verein Schweizer Laser und Photonik Netz (Swissphotonics)


Wissenschaftliche Gesellschaft Lasertechnik e.V. (WLT)



-- Platinum Level Sponsors --

-- Gold Level Sponsors --

OSAKA FUJI Corporation

-- Silver Level Sponsors --

Y-E DATA, Inc.

-- Bronze Level Sponsors --


SLPC 2018 Secretariat, Japan Laser Processing Society (JLPS)
c/o Joining and Welding Research Institute (JWRI), Osaka University
11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan
TEL/FAX: +81-6-6879-8642