June 29 - July 2, 2009
Kobe Convention Center, Kobe, Japan
LPM2009- The 10th International Symposium on Laser Precision Microfabrication
HPL2009- The 5th International Symposium on High Power Laser Processing        
 
ORGANIZERS: JLPS- Japan Laser Processing Society, Japan
AIST- National institute of Advanced Industrial Science and Technology, Japan
RIKEN- The Institute of Physical and Chemical Research, Japan
   

What's new!

  • Visit Gallery to view the pictures from the Conference.
  • For manuscript submission, please access to the following online submission system. (Authors Only)
    https://www.onreg.jp/ics/AuthorLogin.do?eventId=20080926001&mode=login
  • Final Program [ PDF ] has been fixed.
  • Session Chart [ PDF ] has been fixed.
  • Presentation Instructions are now available.
    Instruction for Oral Presentation [ PDF ]
    Instruction for Poster Presentation [ PDF ]
    Session Chair Instruction [ PDF ]
  • Abstract submission due date has been extended to December 31, 2008.
  • For information on Advertisements for "Technical Digests & Congress Program" and Sponsorship Opportunities:
    Japanese [ PDF ]
    English [ PDF ]

LAMP2009 Secretariat     
LAMP2009 Secretariat
(Ms. Hiromi Teraoka)
c/o Katayama Lab.,Joining and Welding Research Insitute (JWRI) Osaka University
11-1 Mihogaoka, Ibaraki, Osaka 567-0047 Japan
TEL/FAX: +81-6-6879-8642
(Exclude "81" and add "0" if making domestic calls. e.g. 06-6879-8642)
E-mail: teraoka@jlps.gr.jp

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