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01
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(Technical Communication) Artificial Intelligence for Estimating Multiple Irradiation Conditions from Temperature Distribution
[DOI: 10.2961/jlmn.2022.03.3001]
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Miki Nakaone, Graduate School of Engineering, Tokyo University of Technology;
Tomomasa Ohkubo , Graduate School of Engineering, Tokyo University of Technology;
Yuki Ueno, Graduate School of Engineering, Tokyo University of Technology;
Ken Goto, Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency;
Yutaka Kagawa, Katayanagi Institute, Tokyo University of Technology;
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(pp.
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Received: May 31, 2022,
Accepted: November 4, 2022
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02
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Direct, Laser-based Production of Optics [DOI: 10.2961/jlmn.2022.03.2004]
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Martin Kahle, ifw Jena – Günter Köhler Institute for Joining Technology and Materials Testing;
Daniel Conrad, ifw Jena – Günter Köhler Institute for Joining Technology and Materials Testing;
Stefan Fricke, ifw Jena – Günter Köhler Institute for Joining Technology and Materials Testing;
Larissa Wilkens, ifw Jena – Günter Köhler Institute for Joining Technology and Materials Testing;
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(pp.
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Received: June 6, 2022,
Accepted: October 31, 2022
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03
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Fabrication of Rectangular Micro-Channels by Ultrashort Pulse Ablation Using a Bessel Beam
[DOI: 10.2961/jlmn.2022.03.2003]
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Jan Marx, Applied Laser Technologies, Ruhr University Bochum;
Jochen Tenkamp, Chair of Materials Test Engineering (WPT), TU Dortmund University;
Frank Walther, Chair of Materials Test Engineering (WPT), TU Dortmund University;
Cemal Esen, Applied Laser Technologies, Ruhr University Bochum;
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(pp.
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Received: May 31, 2022,
Accepted: October 31, 2022
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04
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Analyzing the Electromagnetic Radiations Emitted during a Laser-based Surface Pre-Treatment Process for Aluminium using Diode Sensors as an Approach for High-Resolution Online Monitoring
[DOI: 10.2961/jlmn.2022.03.2002]
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Hans Julius Langeheinecke, Verbindungstechnik Schweißverfahren, Schrauben;
Shahan Tutunjian, Verbindungstechnik Schweißverfahren, Schrauben;
Marcos Soldera, Institut für Fertigungstechnik, Technische Universität Dresden;
Torsten Wegner, Verbindungstechnik Schweißverfahren, Schrauben;
Andrés Fabián Lasagni, Institut für Fertigungstechnik, Technische Universität Dresden;
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(pp.
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Received: May 30, 2022,
Accepted: October 31, 2022
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05
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Time-resolved Spectroscopy of Glass Ablation during Micro-via Processing using 248 nm Excimer Laser for Semiconductor Interposer Packaging [DOI: 10.2961/jlmn.2022.03.2001]
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Yasufumi Kawasuji, Gigaphoton Inc.;
Yasuhiro Adachi, Gigaphoton Inc.;
Kazuhiko Moro, Gigaphoton Inc.;
Kouji Kakizaki, Gigaphoton Inc.;
Masakazu Washio, Waseda University;
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(pp.
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Received: April 13, 2022,
Accepted: October 15, 2022
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