Venue: Pacifico Yokohama, Yokohama, Japan
Co-located with Optics & Photonics International Congress 2020 (OPIC2020) April 20-24,
2020
Cancellation of SLPC2020
Thank you very much for your interest toward SLPC2020- the 4th Smart Laser
Processing Conference which was originally scheduled on April 21-23, 2020
in Yokohama, Japan. We regret to say that in the wake of the unprecedented scare caused by
the new corona virus (COVID-19) all over the world, the Extraordinary Steering
Committee meeting of SLPC 2020 decided to cancel SLPC 2020. We hope that you understand our decision. We hope that the current threat
of the new corona virus tapers down all over the world soon, and we are
looking forward to seeing you at the next SLPC in the future!
Reference: "Announcement of the operation scheme of the conferences in the OPIC2020"
For refund of your registration fee, please contact OPIC2020 Secretariat.
AIM AND SCOPELaser beam processing has played an important role in industrial fields of not only macro-products but also micro-products, and its technologies are essential to open the new strategies of smart manufacturing such as highly integrated, accurate, efficient processing with low energy consumption. SLPC2020 deals with science and technology of smart laser materials processing including micro and macro laser processing. SLPC2020 is planned as a three-day event with a plenary session, oral sessions and poster session.
The aim of this conference is to provide a forum for discussion of fundamental aspects of laser-matter interaction, the state-of-the-art of smart laser processing, and topics for the next generation with fundamental scientists, end users and laser manufacturers. We expect that SLPC2020 would play an important role not only for understanding fundamental knowledge of laser processing but also forecasting future technologies and the future laser processing fields.
During the conference, Optics and Photonics International Exhibition is held jointly at the conference site.
PAST SYMPOSIA: http://www.jlps.gr.jp/slpc/
TOPICS IMPORTANT DATES
| One-Page Digest (Abstract) Submission Starts from | October, 1, 2019 |
| One-Page Digest (Abstract) Submission Due Date | January 28, 2020, JST |
| Registration Starts from |
December 18, 2019 |
| VISA Support Due Date (Advance registration and full payment should be completed.) |
March 19, 2020, JST |
| Early-Bird Registration Due Date | April 7, 2020, JST |
ONE-PAGE DIGEST SUBMISSIONSubmission website: https://opicon.jp/submission
Submission Due Date: January 16, 2020 -> Extended to January 28, 2020, JST
IMPORTANT!
Digest must be submitted in pdf format. Your digest should be written on
the Form.
Digest should include Paper Title, Author(s), Affiliation, Country and
(E-mail address of corresponding author, if agreed) followed by text. Digest
should be no more than one page, A4 letter size paper (210mm x297mm). A
Figure/Table may be included. Please do not exceed the defined margins
or length. Please do not use special characters or fonts except Times New
Roman and Symbol font in your submission form. The guidelines for the abstract
submission are available as a download below:
One-Page Digest Template: DOC file
Manuscript Submission: Not required for SLPC2020.
INVITED SPEKERS: Keynote Speakers
Yohei Kobayashi, The University of Tokyo, Japan
"Toward cyber-physical system of laser processing"
Hideki Kyogoku, Kinki University, Japan
"The research and development results of national project by Technology
Research Association for Future Additive Manufacturing (TRAFAM)"
Reinhart Poprawe, RWTH Aachen University, Germany
"The future of digital photonic production"
Invited Speakers for Joint Session (SLPC+PLD)
Hakaru Mizoguchi, GIGAPHOTON Inc., Japan
"Present status & challenge of high power LPP-EUV source for semiconductor
lithography"
Invited Speakers for SLPC2020 Regular Sessions
Norihiro Dejima, Nichia Corporation, Japan
"High beam quality light source module for laser fine processing"
Markus Kogel-Hollacher, Precitec Optronik GmbH, Germany
"Investigating new concepts for improving the additive manufacturing
process on industrial level"
Tsuyoshi Nakamura, TRUMPF Corporation, Japan
"Laser material processing in E-mobility"
Timotius Pasang, Auckland University of Technology, New Zealand
"Additive Manufacturing: Comparison between selective laser melting
and electron beam melting of Ti6Al4V"
Jean-Michel Pelaprat, NUBURU Inc., USA
"Next generation high power high brightness blue lasers"
Markus Rütering, Laserline GmbH, Germany
"Laser diode technology in welding – From IR via blue to hybrid combination"
Tomokazu Sano, Osaka University, Japan
"Dry laser peening for improving fatigue properties of laser welded
2024-T3 aluminum alloy using femtosecond laser pulses"
Shuntaro Tani, The University of Tokyo, Japan
"Big data acquisition and utilization to quantify laser ablation processes"
Masaya Suwa, Shimadzu Corporation, Japan
"Development of fiber-coupled blue direct diode laser BLUE IMPACT
for copper welding"
Tomonori Yamada, Japan Atomic Energy Agency, Japan
"Analysis of fine particles generated by laser processing for decommissioning of Fukushima Daiichi Nuclear Power Station"
COMMITTEES Conference Chairs
Masahiro Tsukamoto, JWRI, Osaka University, Japan
Reinhart Poprawe, RWTH Aachen University, Germany
International Advisory Committee
Chung-Wei Cheng, National Chiao Tung University, Taiwan
Adam Clare, The University of Nottingham, United Kingdom
Bo Gu, President, BOS Photonics, USA
Yongfeng Lu, University of Nebraska Lincoln, USA
Beat Neuenschwander, Bern University of Applied Sciences,
Institute for Applied Laser, Photonics and Surface Technologies ALPS, Switzerland
Andreas Ostendorf, Applied Laser Technologies, Ruhr University Bochum, Germany
Timotius Pasang, Associate Professor, Head of Department - Mechanical Engineering,
Director - Engineering Research Institute (ERI) Auckland University of
Technology, New Zealand
Sasitorn Srisawadi, National Metal and Materials Technology Center (MTEC), Thailand
Program Committee
Chair:
Masaki Hashida, Kyoto University, Japan
Co-Chairs:
Masahito Katto, University of Miyazaki, Japan
Aiko Narazaki, National Institute of Advanced Industrial Science and Technology (AIST),
Japan
Members:
Yoshio Hayasaki, Utsunomiya University, Japan
Koji Kakizaki, Gigaphoton, Japan
Souta Matsusaka, Chiba University, Japan
Godai Miyaji, Tokyo University of Agriculture and Technology, Japan
Shinji Motokoshi, Institute for Laser Technology, Japan
Takahiro Nakamura, Tohoku University, Japan
Hitoshi Nakano, Kindai University, Japan
Yasuhiro Okamoto, Okayama University, Japan
Tomokazu Sano, Osaka University, Japan
Yoshihisa Sechi, Kagoshima Prefectural Institute of Industrial Technology, Japan
Keisuke Shigemori, Osaka University, Japan
Rie Yamagishi, Fukuoka Institute of Technology, Japan
Steering Committee
Chair:
Yuji Sato, JWRI, Osaka University, Japan
Members:
Akira Fujisaki, Furukawa Electric Co., Ltd., Japan
Kazuki Koda, Denso, Japan
Togo Shinonaga, Okayama University, Japan
Kunihiko Washio, Paradigm Laser Research Ltd., Japan
Yorihiro Yamashita, Industrial Research Institute of Ishikawa, Japan
Other Committee Members: TBA
REGISTRATION HOW TO PRESENT VENUE & ACCESSVENUE:
Pacifico Yokohama
1-1-1
Minato Mirai, Nishi-ku, Yokohama 220-0012, Japan
Access
Yokohama city, Kanagawa prefecture, JAPAN. Yokohama city, the center of
Kanagawa prefecture is located south of Tokyo. Pacifico Yokohama is conveniently
located about 40 min. by Limousine Bus from Haneda Airport and 90 min.
from Narita Airport.
VISA APPLICATION ACCOMMODATION COOPERATING SOCIETIES and MEDIA PARTNERSAssociation of Industrial Laser Users (AILU）
Wissenschaftliche Gesellschaft Lasertechnik e.V. (WLT)
SPONSORSPLATINUM Level Sponsor
JBM Engineering Corporation
GOLD Level Sponsors
AMADA CO., LTD.
FURUKAWA ELECTRIC CO., LTD.
Kataoka Corporation
Laserline GmbH
TRUMPF CORPORATION
Yamazaki Mazak Corporation Ltd
SILVER Level Sponsors
Eagle Industry Co., Ltd.
Fuji Koushuha Industry Co., Ltd.
JFE STEEL CORPORATION
NDK Inc.
Precitec Japan, Ltd.
SURUGA SEIKI CO., LTD..
YASKAWA Electric Corporation
OKAMOTO OPTICS, INC.
BRONZE Level Sponsors
AICHI SANGYO CO., LTD.
Gigaphoton Inc.
MITSUBISHI CABLE INDUSTRIES, LTD.
MURATANI MACHINE MANUFACTURE CO., LTD.
NADEX Co., Ltd.
Olympus Medical Science Sales Corporation
OSAKA FUJI Corporation
PCL Co., Ltd.
Shimadzu Corporation
SIGMAKOKI CO., LTD.
Spectronix Corporation
YAMAMOTO KOGAKU CO., LTD.
CONTACT