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IMPORTANT !

We have put a new number to each papers. PLease see the advance program.
When you send your manuscript to SPIE, please write this new number in reverse side of your manuscript.
If you already have sent your manuscript to SPIE putting old number, that is no problem. We would send the table of those new numbers to SPIE too.

Dead lines
Feb 01, 2002 : Acceptance Notice to Authors
Apr 13, 2002 : Early Registration
May 27, 2002 : Final Manuscript
May 10, 2002 : Audio Visual Request

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Instructions for Presentations

Oral Presentations: The oral sessions will consist of both invited and contributed talks. Invited presentations will be allotted 30 minutes (25 min. talk + 5 min. discussion); contributed presentations will be allotted 20 minutes (15 min. talk + 5 min. discussion).
Poster Preparations: Each poster will occupy a posterboard with the dimensions 210 cm x 120 cm (H x W).

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Aims and Scope

The International Congress on Laser Advanced Materials Processing (LAMP) deals with science and technology of advanced laser processing including precision microfabrication and high power laser macro processing. Former LAMP conferences held in 1987 (Osaka) and 1992 (Nagaoka) have won reputation and popularity for some of the most excellent international meetings in the world. Considering the requests from all over the world, LAMP2002 will be held at Osaka University in 2002. LAMP 2002 consists of 3rd International Symposium on Laser Precision Microfabrication (LPM 2002) and 1st International Symposium on High Power Laser Macro Processing (HPL 2002) and covers hardware as well as software for fundamental research and industrial applications in both micro and macro processing. LAMP 2002 is planned as a five day event with a plenary session, three special sessions, both oral and poster sessions for LPM and HPL, and a table top exhibition. The aim of this congress is to provide a forum for discussion of fundamental aspects of laser-material interaction, the state of the art of laser materials processing, and topics for the next generation by fundamental scientists, end users and laser manufactures. Many world authorities in this field are invited to LAMP 2002. Thus, we expect that LAMP 2002 would play an important role for not only to establish fundamental technologies for laser materials processing but also to make clear the factors that are limiting its real application, future technologies to be developed and for forecasting the future laser market.

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Topics

Select 1 to 3 terms among the topics below, and indicate the number. The selected topics will be used as a program reference.

LPM2002 :

1. Fundamentals of laser - material interaction
2. Modeling and simulation
3. Process monitoring and control
4. Ultra-short pulsed laser processing
5. Laser micro-machining
6. Laser micro-drilling
7. Laser micro-cutting
8. Laser patterning and texturing
9. Laser micro-welding
10. Laser micro-forming
11. Laser cleaning
12. Laser annealing
13. Surface modification
14. Laser marking
15. Laser trimming
16. Laser lithography
17. Laser assisted chemical process
18. Organic materials
19. Inorganic materials
20. Micro devices and systems
21. Thin film deposition
22. Medical and biological applications
23. Laser optics
24. New laser devices and beam delivery systems
25. Present status and future prospects in market for laser apprications
26. Industrial Applications
27. EUV Source and Application
28. Others

HPL2002 :

1. Fundamentals of laser-materials interactions
2. Laser-induced plasma
3. Monitoring and control
4. Modeling and simulation
5. Materials and metallurgical aspects
6. Evaluation of properties (strength, etc.)
7. High power laser diode
8. Gas laser
9. Solid-state laser
10. Optics
11. Beam delivery system
12. Welding
13. Welding of light metals and alloys
14. Tailored-blank welding
15. Hybrid welding
16. Drilling and cutting
17. Cleaning
18. Surface modification (quenching,, alloying, etc.)
19. Cladding
20. Rapid prototyping
21. Forming and shaping
22. New and innovative applications （Sandwich panel, etc.）
23. Applications (Automobiles, ship, trains, airplanes, etc.)
24. Applications (steel, motors, parts, nuclear fields, etc.)
25. Present status and future prospects
26. Others

Special Session :

1. Tailored Materials Properties
2. LD and LD Direct Processing
3. Ultrafast Pulse Laser processing

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Symposium Format

The symposium program will be comprised of invited and contributed papers. The contributed papers will be refereed by the members of the Program Committee on the basis of submitted abstracts. The accepted paper will be presented as an oral or poster presentation.

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Contributions

Submitted abstracts should contain original, recent unpublished results of HPL or LPM. Authors are asked to secure company and/or governmental security clearance to present and publish the data, prior to abstract submission. To ensure a high-quality congress, all abstracts will be reviewed by the Program Committee for technical merit and content. The Program Committee may ask some authors to change the presentation style (oral / poster). The papers will be refereed by the Program Committee and attendees of the conference appointed by the Program Committee prior to publication as a Proceedings of SPIE.

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Invited Speakers

(1) Plenary Session:

• Reinhart Poprawe (Lehrstuhl fur Lasertechnik, Germany)
  "The bright future of Laser Technology"
• Claude R. Phipps (Photonic Associates, USA)
  "Overview of laser applications: Tthe state of the art and the future trend"
• (Total three presentations will be presented)
  

(2) LPM2002 (Laser Precision Micro Fabrication)

1.Nanotechnology

• Michael Stuke (Osaka University, Japan)
  "Laser-induced expansion, melting and ablation mechanisms of organic materials"

2．Microfabrication

• Simeon Metev(BIAS, Germany)
  "Selective thermo-/photochemical treatment of materials - a new trend in laser micro technology"
• H J Baker and D R Hal(Heriot-Watt University, UK)
  "Micromachining using high peak power, high repetition rate, short pulse CO₂ "

3. Microsystem

• Alberto Pique, (NRL,USA)
  "Laser-induced forward transfer direct write of miniature sensor and microbattery systems"
• Koji Ikuta, (Nagoya Univ., Japan)
  "Fabrication of biochemical IC chips by laser 3-D fabrication."
• Michel Meunier, (Ecole Polytechnique de Montreal, Canada)
  "A new laser trimming technique for silicon analogue microelectronics."

4．Pulsed Laser Deposition

• Carmen N. Afonso (Instituto de Optica, CSIC, Spain)
  "Metal nanocomposites for all-optical switching."

5．Modification and Surface Treatment

• Junji Nishii (AIST-Kansai, Japan)
  "Athermal optical waveguide filter fabricated by short pules laser irradiation."

6．System and Optics

• Fred Dylla (The Jefferson Laboratory, USA)
  "A kilowatt average power laser with sub-picosecond pulses for materials science and materials processing."
• Uwe Stamm(XTREME technologies GmbH, Germany)
  "Overview on EUV source development and applications"

7. Applications

• Worlgang Knapp (COOPERATION LASER FRANCO-ALLEMANDE, France)
  "Status and evolution of laser precision microfabrication in France."
• Willem Hoving(Philips Electronics, Netherlands)
  "Laser microprocessing in the microelectronics industry: current trends and new challenges"
• James Brannon(IBM Storage Technology Division, USA)
  "Laser material processing applications in the data storage industry."
  

(3) HPL 2002 (High Power Laser Macro Processing)

1．Lasers and Their Applications

• Helmut Huegel (University of Stuttgart, Germany)
  "Innovative high power lasers for welding applications"
• Dirk Petring (FhG ILT, Germany)
• Konstantin Boucke (FhG ILT, Germany)
  
• Kenichi Matsuno (Manufacturing Science and Technology Center, Japan)
  "Development of high power lasers in the Japanese national project"
• Leonard Marabella(TRW, USA)
  

2．Welding of Al

• Richard Martukanitz,(ARL, The Pennsylvania State University, USA)
  

3．Heavy Industrial Applications

• Takashi Ishide(Mitsubishi Heavy Industries, Ltd., Japan)
  "High Power YAG laser applications in heavy section"
• Frank Roland, (Meyer Werft, Germany)
  "Laser Welding in Shipbuilding - Latest Developments"
• Magdi N. Azer,(GE Aircraft Engines, USA)
  "Laser Processing at GE Aircraft Engines"
• Paul Denney,(Edison Welding Institute, USA)
  "The Impact of Hybrid Welding On The Performance Of Structural Components"

4．Steel Industries

• Katsuhiro Minamida,(Nippon Steel Corp. Japan)
  "High Power Laser Applications in Nippon Steel Corporation"
• Daniel Wenk,(Soudronic AG. Swidtzeland)
  
• Wilfried Prange,(ThyssenKrupp Stahl, Germany)
  "Laser - A Tool for Leight Weight Steel Solutions for the Automotive Industry"

5．Automotive Industries

• Remy Fabbro (CLFA-Cooperation Laser Franco-Allemande, France)
• (Total five presentations will be presented)
  

6．Others

• Paul A. Hilton(TWI, UK)
  

(4) Special Session

1． Tailored Materials Properties

• Jyoti Mazumder(Univ. of Michigan, USA)
  "Designed Materials: What and How"
• Geld Sepold (BIAS-Bremen Institute of Applied Beam Technology, Germany)
  "Laser Joining Technologies for Dissimilar Material Combinations"
• M. Geiger (Lehrstuhl fur Fertigstechnologie -LET, Germany)
  "Laser assisted generation of electronic circuits on tailored thermoplastics"
  

2．LD and LD Direct Processing

• 
  
• 
  

3．Ultrafast Pulse Laser Processing

• Nadeem Rizvi(Exitech, UK)
  "Femtosecond Laser Micromachining - An overview of the European FEMTO project and other developments."
• S.I. Anisimov (Landau Inst. For Technical Physics, Russia)
  "Mechanism of ultrashort pulse laser ablation."
• Martin C. Richardson(Univ, of Central Florida, USA)
  "Femtosecond laser hole drilling in an ambient environment."
• Kazuyoshi Itoh(Osaka Univ., Japan)
  "Nano- and microprocessing in glass using fs laser."
• Holger Lubatschowski (Laser Zentrum Hannover e.V., Germany)
  "Overview of medical and biological application of ultrafast pulse laser."

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Submission of Abstracts

Your abstract should include:

1. Preferred Conference
Select one conference or session which you would like to contribute to among the following:
(1) LPM (Laser Precision Microfabrication)
(2) HPL (High Power Laser Macro Processing)
(3) Special Session 1, 2, 3
2. Paper Title
3. Authorship
First (given) name, Last (Family) name, , Affiliations, for ALL authors.
4. Corresponding Author
Mailing address, Telephone, Fax numbers and E-mail address
5. Abstract within 200 words
Text，only, no pictures, graphics, charts, etc.
6. Topics
(Select 1 to 3 terms among 3 or 26 topics in the previous page, and indicate the number. The selected topics will be used as a program reference.)
7. Presentation
Please indicate your preference for Oral Presentation or Poster Presentation.

All abstracts can be submitted by one of the following options before Nov 30, 2001. Submission via email or Homepage is preferred. For abstracts submitted as an e-mail body (not as an attachment) or a web site message, do not use special characters or symbols in your text.

• E-mail:        lamp-abs@jlps.gr.jp
  

• Homepage:    Click here

• Mail:

  LAMP2002
  JapanLaser Processing Society c/o Miyamoto Laboratory
  Department of Manufacturing Science
  Graduate School of Engineering
  Osaka University
  2-1, Yamada-Oka, Suita, Osaka, 565-0871, Japan
  

• Fax:

  +81-6-6879-7534
  

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  Publication Policy

  Manuscript due dates must be strictly observed. Late manuscripts run the risk of not being published in the proceedings. Detailed instructions on preparing a camera-ready manuscript will be sent to contributors with the acceptance notice
  

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  Paper Review

  To ensure a high-quality conference, all abstracts and Proceedings of SPIE papers will be reviewed by the Program Committee for technical merit and content.
  

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  Submission of manuscript

  The original manuscript, plus one copy, should be sub-mitted by May 27, 2002. All authors should send their manuscripts by mail to:
  SPIE - The International Society for Optical Engineering
  PO Box 10, Bellingham, WA 98227-0010 USA
  
  The address when you use Courier (express) mail:
  1000 20th Street, Bellingham, WA 98225 USA
  
  At the conference hall, JLPS will prepare the desk for your manuscript submission. The accepted manuscript dur-ing the conference days would be sent to SPIE by JLPS.
  When you send your manuscript to SPIE, please write "The manuscript of LAMP2002" on the envelope.
  

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  Participant Registration Fee

  (Participant Full Registration Fee includes one technical digest, one proceedings book either of LPM or HPL and the banquet.)
  
  Early Registration (Full Registration Payment Received by13 April 2002):
  • Member of JLPS or SPIE: \42,000
    
  • Non-Member: \48,000
  
  Full Registration Payment Received after 14 April 2002 by 20 May 2002, or On-site:
  
  • Member of JLPS or SPIE: \53,000
    
  • Non-Member:\58,000
  
  One day Ticket: \21,000
  
  Student Registration: \10,000
  
  Please note: Banquet and proceedings is not included with student registration and one day ticket. Student registration will not be processed without a copy of your Valid Student ID. Please include with Registration form.
  Extra Banquet Ticket: \7,000
  Registration form
  

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  Honorary Chairs:
  Yoshiaki Arata(JLPS, Japan)
  Akira Matsunawa (Osaka University, Japan)
  Conference Chair:
  Isamu Miyamoto (Osaka University, Japan)
  Conference Co-Chairs:
  Kojiro F. Kobayashi (Osaka University, Japan)
  Koji Sugioka (RIKEN, Japan)
  Reinhart Poprawe (Fraunhofer ILT, Germany)
  Henry Helvajian (The Aerospace Corporation, USA)
  
  Organizing Committee:
  Nobuyuki Abe(Osaka Univ. Japan); Friedrich Bachmann (ROFIN-SINAR Laser GmbH, Germany); Ralf Eckhard Beyer (IWS, Germany); Tow-Chong Chong(DSI, Singapore); Paul Denney(Edison Welding Institute, USA); Walter W. Duley(University of Waterloo, Canada); Kenshi Fukumitu (Hamamatsu Photonics, Japan); Arnold Gillner (Fraunhofer-Institute fuer Lasertech, Germany); Yeow-Whatt Goh (DSI, Singapore); Akio Hirose(Osaka Univ., Japan); Hideo Hisada (KOMATSU, Japan); Youichiro Hosokawa (Osaka Univ., Japan); Narumi Inoue(National Defence Academy, Japan); Takashi Ishide (Mitsubishi Heavy Industry, Japan); Shin-ichi Ishizaka(Japan Steel Works, Japan); Kazuyoshi Itoh (Osaka Univ., Japan); Yoshiro Itoh (Nagaoka University of Technology, Japan); Seiji Iwama (Shibaura Mechatronics Corp., Japan); Takahisa Jitsuno(Osaka Univ., Japan); Teruyoshi Kadoya (Trumpf, Japan); Hidehiko Karasaki (Matsushita Industrial Equipment, Japan); Seiji Katayama(Osaka Univ., Japan); Akikazu Kitagawa(Hitachi Zosen, Japan); Yong-feng LU(DSI, Singapore); Hiroshi Masuhara (Osaka Univ., Japan); Kenichi Matsuno （RIPE, Japan）;Hiroshi Miura(Shizuoka Univ., Japan); Kiyokazu Mori (NISSAN, Japan); Sumio Nakahara (Kansai Univ., Japan); Yoshimitsu Nakamura(Matsushita Electric Works, Japan); Yoshiki Nakata (Kyusyu Univ., Japan); Hirokuni Namba(Sumitomo Electric Industries, Japan); Hiroyuki Niino (AIST Tokyo, Japan); Satoru NishioMie Univ., Japan); Etsuji Ohmura(Osaka Univ., Japan); Tatsuo Okada(Kyusyu Univ., Japan); Masayuki Okoshi (National Defence Academy, Japan); Moriaki Ono (NKK, Japan); Toshihiko Ooie(AIST Shikoku, Japan); Marek Osinski(University of New Mexico, USA); Andreas Ostendorf (Laser Zentrum Hannover, Germany); Tomokazu Sano (Osaka Univ. Japan); Uwe Stamm(Lambda Physik GmbH, Germany); Masaaki Tanaka (Mitsubishi Electric, Japan); Keisuke Uenishi (Osaka Univ., Japan); Osamu Wakabayashi(Gigaphoton, Japan); TakehiroWatanabe (Chiba Univ., Japan); Ken Watkins(Univ. of Liverpool, UK); Wataru Watanabe(Osaka Univ., Japan); Kozo Yasuda(Kawasaki Heavy Industries, Japan); You-Huan Yeo(DSI, Singpaore); Remy Fabbro(CLFA, France)
  
  Program Committee:
  Nobuyuki Abe(Osaka Univ); Ralf Eckhard Beyer(IWS, Germany); Dauglas Chrisey (NRL, USA); Friedrich Dausinger(University of Stuttgart, Germany); Jan Dubowski(NRC, USA); Costas Fotakis(FORTH-IESL, Greece); Malcolm C. Gower(Exitech Ltd., UK); Peter Herman(University of Toronto, Canada); Akio Hirose(Osaka Univ., Japan); Hideo Hisada(KOMATSU, Japan); Andrew Holmes(Imperial College, UK); Willem Hoving(Philips Electronics, Netherlands); Jurgen Ihlemann(Laser Laboratorium Gottingen, Germany); Takashi Ishide (Mitsubishi Heavy Industry, Japan); Shin-ichi Ishizaka(Japan Steel Works, Japan); Kazuyoshi Ito(Osaka Univ., Japan); Yoshiro Ito (Nagaoka University of Technology, Japan); Takahisa Jitsuno (Osaka Univ., Japan); Seiji Katayama(Osaka Univ., Japan); Hidehiko Karasaki (Matsushita Industrial Equipment, Japan); Akikazu Kitagawa(Hitachi Zosen, Japan); Vitali Konov(GPI, Russia); Ernst W. Kreutz(Lehrstuhl fur Lasertechnik,Germany); William P. Latham (Air Force Research Laboratory DEOB, USA); Cheon Lee(IN-HA University, Korea); Yong-feng Lu(DSI, Singapore); Boris Luk`yanchuk,(Data Storage Institute, Singapore); Hiroshi Masuhara(Osaka Univ., Japan); J.O. Milewski(Los Alamos National Laboratories, USA); Kiyokazu Mori(Nissan Motor, Japan); Sumio Nakahara(Kansai Univ., Japan); Yoshimitsu Nakamura(Matsushita Electric Works, Japan); Hiroyuki Niino(AIST Tokyo, Japan); Junji Nishii(AIST Kansai, Japan); Etsuji Ohmura (Osaka Univ., Japan); Tatsuo Okada(Kyushu Univ., Japan); Toshiharu Okada(Matsushita Electric Industrial, Japan); Moriaki Ono(NKK, Japan); Toshihiko Ooie(AIST Shikoku, Japan); Andreas Ostendorf(Laser Zentrum Hannover, Germany); Alan Petersen (Spectra Physics, USA); Tomokazu Sano(Osaka Univ., Japan); Geld Sepold (BIAS, Germany); Uwe Stamm (Lambda Physik GmbH, Germany); Masaaki Tanaka (Mitsubishi Electric, Japan); Jay F. Tu(Purdue Univ., USA); Susumu Tsukamoto (National Institute for Materials Science, Japan); Vadim P. Veiko (Saint-Petersburg Federal Institute, Russia); Kunihiko Washio(NEC, Japan); Takehiro Watanabe(Chiba Univ., Japan); XianFan Xu(Purdue Univ., USA); Hiroto Yamaoka(IHI)
  
  
  Steering Committee:
  Chairman:
  Etsuji Ohmura(Osaka Univ.); Toshihiko Ooie(AIST Shikoku);
  Members:
  Nobuyuki Abe(Osaka Univ.); Kenshi Fukumitu(Hamamatsu Photonics); Akio Hirose(Osaka Univ.); Hideo Hisada(KOMATSU, Japan); Youichiro Hosokawa(Osaka Univ.); Narumi Inoue(National Defence Academy); Takashi Ishide(Mitsubishi Heavy Industry); Shinichi Ishizaka(Japan Steel Works); Kazuyoshi Ito(Osaka Univ.); Yoshiro Ito(Nagaoka University of Technology); Seiji Iwama, Takahisa Jitsuno(Osaka Univ.); Teruyoshi Kadoya (Trumpf, Japan); Hidehiko Karasaki(Matsushita Industrial Equipment, Japan); Seiji Katayama(Osaka Univ.); Akikazu Kitagawa(Hitachi Zosen, Japan); Masao Kubo(Matsushita Electric Works, Japan); Hiroshi Masuhara(Osaka Univ.); Hiroshi Miura(Shizuoka Univ.); Kiyokazu Mori(Nissan Motor, Japan); Sumio Nakahara(Kansai Univ.); Yoshimitu Nakamura(Matsushita Electric Works); Yoshiki Nakata(Kyusyu Univ.); Hirokuni Namba (Sumitomo Electric Industries); Hiroyuki Niino(Aist Tokyo); Jyunnji Nishii(Aist Kansai); Satoru Nishio, Tatsuo Okada(Kyusyu Univ.); Toshiharu Okada(Matsushita Electric Industrial); Masayuki Okoshi(National Defence Academy); Moriaki Ono(NKK); Tomokazu Sano(Osaka Univ.); Koji Sugioka(RIKEN); Masaaki Tanaka (Mitsubishi Electric); Keisuke Uenishi(Osaka Univ.); Osamu Wakabayashi(Gigaphoton); Kunihiko Washio(NEC); Takehiro Watanabe (Chiba Univ.); Wataru Watanabe(Osaka Univ.); Kouzou Yasuda(Kawasaki Heavy Industries);

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  Cooperating Organizers:
  LIA-Laser Institute of America
  JSPE-Japan Society for Precision Engineering
  JIEP-Japan Institute of Electronics Packaging
  JSAP-The Japan Society of Applied Physics
  LSJ-The Laser Society of Japan
  JSME-The Japan Socity of Mechanical Engineers
  JWS-Japan Welding Society
  CRCAST-Collaborative Research Center for Advanced Science and Technology, Osaka University
  Mate2002-Microjoining and Assembly Technology in Erectronics, Committee of MicroJoining, Japan Welding Society
  

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  Organizers:
  JLPS - Japan Laser Processing Society
  RIKEN - The Institute of Physical and Chemical Research
  DSI - Data Storage Institute, National University of Singapore
  HTS - High Temperature Society of Japan
  Graduate School of Engineering, Osaka University
  SPIE - The International Society for Optical Engineering
  

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  Acknowledgement:
  We wish to thank the following for their contribution to the success of this conference:
  U.S. Air Force Office of Scientific Research, Asian Office of Aerospace Research and Development (U.S. AFOSR/AOARD)
  

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  Copyright LPM 2000 Laser Microprocessing Lab
  Updated: 01 March 2002 by JLPS