The 4th International Congress on Laser Advanced Materials Processing

May 16-19, 2006, Kyoto Research Park, Kyoto, Japan
http://www.krp.co.jp/english/index.html
LPM2006-The 7th International Symposium on Laser Precision Microfabrication
HPL2006-The 4th International Symposium on High Power Laser Processing
< LAST UPDATE: November 30, 2006 JST >


"Online Proceedings of LAMP2006"
(Login name & Password Required)


Note:
Full-Registration includes the access fee for "Online Proceedings of LAMP2006".
One-Day/Student Registration does NOT include the access fee.
If you wish to obtain the login name & password
to enter the "Online Proceedings of LAMP2006" website,
please fill out the following order form, and fax it to LAMP2006 Office at +81-6-6879-8642.
ORDRE FORM: [ PDF ]
If you forget your own login name/password,
please feel free to contact LAMP office as well.


Award Results

Advance Program
(Rev.5/14)


Addendum & Changes



IMPORTANT DATES

Abstract Submission Due Date: November 30, 2005 Extended to Dec. 10, 2005 JST

Early Online-Registratoin Due Date: April 20, 2006
Hotel Reservations Cut-Off Date: April 20, 2006

Manuscript Submission Due Date: May 16, 2006
(On-Site Submission)


AIMS and SCOPE

The International Congress on Laser Advanced Materials Processing (LAMP) deals with science and technology of advanced laser materials processing covering precision microfabrication and high power laser processing.  Basically LAMP is held every four years, and the former LAMPs have won the good reputation and popularity as the one of the most excellent international meetings in the world.  LAMP 2006 is held during May 16-19, 2006, in Kyoto, the ancient capital of Japan with the most authentic and traditional atmosphere.  LAMP 2006 consists of International Symposia on Laser Precision Microfabrication (LPM) and High Power Laser Processing (HPL) and covers hardware as well as software for fundamental research and industrial applications in both micro and macro processing.  LAMP 2006 is planned as a four-day event with a plenary session, oral and poster sessions, special sessions dealing with topical issues, and a table-top exhibition with inviting most important world authorities in this field.  The aim of this congress is to provide a forum for discussion of fundamental aspects of laser-matter interaction, the state-of-the-art of laser materials processing, and topics for the next generation with fundamental scientists, end users and laser manufactures.  We expect that LAMP 2006 would play an important role not only for understanding fundamental knowledge of laser materials processing but also forecasting future technologies to be developed and the future laser market.


General Chair:
Isamu Miyamoto, Osaka University, Japan

Co-Chairs:
Koji Sugioka, RIKEN, Japan
Seiji Katayama, Osaka University, Japan
Henry Helvajian, The Aerospace Corporation, USA
Friedrich H. Dausinger, University of Stuttgart, IFSW, Germany
Kazuyoshi Itoh, Osaka University, Japan


Organizers:
JLPS-Japan Laser Processing Society, Japan
AIST-National Institute of Advanced Industrial Science and Technology, Japan
RIKEN-The Institute of Physical and Chemical Research, Japan


       

         Kinkaku-ji Temple             Ryuan-ji Temple (Zen Rock Garden)   Maiko (apprentice geisha)

Photo©Kyoto Convention Bureau


LPM2006 TOPICS

01 Fundamental aspects (Dynamics, modeling, simulation, etc.)
15 Marking and trimming
02 Process monitoring and control 16 Packaging and mounting process
03 Laser- and photochemistry 17 Lithography (including EUV source and application)
04 Nanotechnology 18 Manufacturing of micro devices and systems
05 Ultra-short pulse laser processing 19 Film deposition and synthesis of advanced materials (PLD, CVD, etc.)
06 VUV laser and x-ray processing 20 Nanomaterials synthesis
07 Surface treatment (Texuring, cleaning, annealing, modification, etc.) 21 Optics and systems for laser micro- and nano-processing
08 Micro-patterning and micro-structuring 22 Laser devices
09 Micro-machining 23 Industrial applications
10 3-D micro- and nano-fabrication 24 Special Session L1: (SP L1)
The future of ultrashort laser manufacturing
11 Micro drilling and cutting 25 Special Session L2: (SP L2)
Laser-based direct-write techniques
12 Micro welding and bonding 26 Special Session L3: (SP L3)
Laser micro/nano-engineering for biomedical applications
13 Micro forming 27 Others
14 Wafer dicing



HPL2006 TOPICS
(Revised as of Nov.10)

01 Fundamentals of laser-materials interactions 14
Hybrid welding
02 Laser-induced plasma 15 Laser welding of light metals
03 Process sensing, monitoring and control 16 Welding imperfection and defects
04 Modeling and simulation 17 Materials removal (Cutting, drilling, etc.)
05 Materials and metallurgical aspects 18 Surface modification and fabrication
(Quenching, alloying, cleaning, etc.)
06 Evaluation of properties
(Strength, etc.)
19 Cladding
07 Laser systems (Remote control, etc.) 20 Rapid prototyping
08 Gas laser 21 Forming and shaping
09 Solid-state laser 22 New and innovatice applications (Sandwich panel, etc.)
10 High power laser diode 23 Applications (Automobiles, ship,
trains, airplanes, etc.)
11 LD-pumped solid laser 24 Applications (Steel, motors,
parts, nuclear fields, etc.)
12 Optics and beam delivery systems 25 Present status and future prospects
13 Welding and brazing 26 Others



JOINT SESSION of LPM & HPL (JS)

01 Crossover regions of LPM & HPL
02 Special Session J1: (SP J1)
Advances in fiber and disk lasers and their novel applications to materials
processing



PLENARY TALKS

Eckhard Beyer (Fraunhofer IWS, Dresden, Germany):
Laser macro processing - Today and tomorrow

Eric Mazur (Harvard University, USA):
Femtosecond laser micro and nano engineering for photonics and biology


Koji Yasui (Mitsubishi Electric Corporation, Japan):
Laser developments for macro and micro demands


INVITED SPEAKERS for LPM2006

Special Session L1: (SP L1)
The future of ultrashort laser manufacturing

Man Seop Lee (PHOCO Company, South Korea):
Femtosecond laser-assited micro-machining for display panel and optical device applications


Ralf Knappe
(Lumera Laser, Germany):
Picosecond lasers for manufacturing


Special Session L2: (SP L2)
Laser-based direct-write techniques


Boris Chichkov (Laser Zentrum Hannover e.V., Germany):
2D and 3D photofabrication with fs lasers for applications in photonics and biomedicine

Frank Livingston (The Aerospace Corporation, USA):
Tailoring light pulses for optimal laser processing and material modification applications

Pere Serra (University of Barcelona, Spain):
Laser-induced forward transfer: a direct writing technique for biosensors preparation


Special Session L3: (SP L3)
Laser micro/nano-engineering for biomedical applications


Alfred Vogel (Institute of Biomedical Optics, Unversity of Lubeck, Germany):
Femtosecond laser nanosurgery of biological cellls and tissues


Benoit Simard (Steacie Institute for Molecular Sciences, Canada):
Laser-assisted preparation and characterization of core-shell Fe@Au nanoparticules for biological applications

Shunichi Sato (National Defense Medical College, Japan):
Targeted gene transfection by the use of laser-induced stress wave

Fundamentals and Theoretical Approach

Nadezda Bulgakova (Institute of Thermophysics, Russia):
Theoretical models and qualitative interpretations of fs-laser material processing

Nanostructuring
Samuel S. Mao (Lawrence Berkeley National Laboratory, USA):
Photonic semiconductor one-dimensional nanostructures fabricated by fs lasers

Laser-and Photochemistry
Stavros Pissadakis (IESL-FORTH, Greece):
Deep UV radiation induced photodissociative processes in transparent optical materials: index engineering and structural modification effects


Analytical Application
Eric Mottay (Amplitude Systemes, France):
Femtosecond laser applications in analytical chemistry

Advanced Material Synthesis
Shojiro Komatsu (Advanced Materials LaboratoryNational Institute for Materials Science, Japan):
Sp3-bonded 5H-BN films grown by plasma-assisted laser CVD for electron field emitter applications: its growth mechanism and the FE properties

Simeon Metev
(BIAS-Bremer Institut fuer Angewandte Strahltechnik, Germany):
Laser-induced high-rate photon plasma CVD synthesis of diamond coatings in air


Glass/Ceramics Processing
Heinrich Graener (Matin-Luther-University Halle-Wittenberg, Germany):
Structuring of nanocomposite glass using femtosecond lasers

Organic Material Processing
Horst-Guenter Rubahn
(Fysisk Institut, Syddansk Universitet, Denmark):
UV-laser forming of organic nanoaggregates and polymeric films

Micromachining
Andreas Ostendorf (Laser Zentrum Hannover e.V., Germany):
Metal and Polymer Microparts Generated by Laser Rapid Prototyping


Assembling of Microcomponents
Natallia Karlitskaya (Philips Applied Technologies, The Netherlands):
Laser-assisted micro components assembly: releasing control and placement accuracy improvement investigation

Laser Applications in Industry
Adrian Boyle (Xsil Limited, Ireland):
Advanced laser machining technology and systems for semiconductor manufacturing

Takashi Shindo (Matsushita Electric Works, Ltd., Japan):
Laser patterning method with dynamic focus control


INVITED SPEAKERS for HPL2006


Zhaogu Cheng (Shanghai Institute of Optics and Fine Mechanics, CAS, China):
Study on hybrid laser welding with novel self-adaptive optical device for shipbuilding applications

Remmy Fabbro (LALP (CNRS) / GIP GERAILP, France):
Dynamic control of melt pool behavior using gas jet during CW Nd-Yag laser welding

Paul Hilton (TWI Ltd., UK):
The effect of spot size and beam parameter product when welding aluminium and steel with high power fibre delivered laser beams

Ernst Wolfgang Kreutz (Fraunfoher-Institute fuer Lasertechnik, Germany):
Laser metal deposition- A powerful tool for turbo machinery


Veli Kujanpää (Lappeenranta University of Technology, Finland):
R & D activities and specific industrial applications of laser processing in Finland

Jyoti Mazumder (The University of Michigan, USA):
A novel method for lap welding of automotive sheet steel using high power CW CO2 Laser

Dirk Petring (Fraunhofer Institute for Laser Technology, Germany):
Enhancing laser system flexibility with the combi-head for cutting and joining

Paul Denney (The Edison Welding Institute, USA):
High power fiber lasers and their potential impact on manufacturing


Friedrich Dausinger (Institut fuer Strahlwerkzeuge, IFSW, Germany):
Diagnostic and prevenstion of laser wald defects

INVITED SPEAKERS for JOINT SESSION of LPM & HPL (JS)

Frank Vollertsen (BIAS-Bremer Institut fuer Angewandte Strahltechnik, Germany):
Fiber laser welding - Basic investigations and application studies


Adolf Giesen (University of Stuttgart, IFSW-Institut fuer Strahlwerkzeuge, Germany):
Potential of disk lasers (Tentative)

Kurt Mann (Trumpf Laser GmbH, Germany):
High power disk lasers and their applications


David Payne (SPI, UK):
Potential of fiber lasers (Tentative)

Hans-Juergen Kahlert (Jenoptik, Germany):
High power, high repetition rate green q-switched lasers for annealing applications

Seiji Katayama (Osaka University, Japan):
Laser-assisted metal and plastic (LAMP) joining

Reinhart Poprawe (Fraunhofer Institute for Laser Technology, Germany):
Prospective of laser macro processing


SPECIAL SESSIONS of LPM2006

SP L1) The future of ultrashort laser manufacturing
Organizer: Peter Herman
(University of Toronto, Canada)

Ultrashort lasers have slowly evolved into reliable sources that now present unique opportunities for manufacturing applications. When are ultrashort pulses advantageous? Is picosecond duration enough? In this session, industry speakers address the utility of both picosecond and femtosecond lasers in manufacturing by examining:
- the reliability of new ultrafast laser systems,
- benefits of picosecond and femtosecond interactions,
- the merits of pulse shaping and repetition rate,
- the industrial forefront in nanofabrication,
- successful commercial applications of ultrashort lasers.


SP L2) Laser-based direct-write techniques
Organizers: Alberto Pique (Naval Research Laboratory, USA); Andreas Ostendorf (Laser Zentrum Hannover, Germany); Craig Arnold (Princeton University, USA)

In the past few years, significant progress has been made in the use of lasers for direct-write applications. Laser-based direct-write techniques offer the ability to perform ablation, transfer or modification of virtually any type of material or surface in a point-wise fashion, opening the opportunity for the fabrication of novel structures or devices. LPM 2006 will host a special session in laser direct-write to explore the latest developments in this expanding area. Papers are solicited in the use of laser direct-write techniques for electronic, photonic, microfluidic, sensing and biomedical applications. This session will also accept contributions in the use of ultrafast lasers for direct-write, fabrication of 3-D microstructures, materials development for laser direct-write and studies of the fundamental mechanisms responsible for the process.

SP L3) Laser micro/nano-engineering for biomedical applications
Organizer: Michel Meunier
(Ecole Polytechnique de Montreal, Canada)

The use of lasers for microprocessing biological and biocompatible materials is now becoming an established enabling technology and various industrial and medical applications are emerging at an increasing rate.  This special session will focused on the development and modeling of new laser processing of biological and biocompatible materials. Papers are solicited on, but not limited to, the following topics within the broad area of biomedical applications: fundamental aspects and modeling of laser-biomaterials and tissue interaction (from cw to fs time scales and from VUV to IR); laser modification, cleaning and texturing of biomaterials; Pulsed laser deposition, laser pattern transfer, laser-induced forward transfer, and direct-write of biocompatible thin films; Diagnostics for in situ laser microprocessing for biomedical applications; Laser micro-engineering and nano-engineering of biomaterials and nanomaterials; Laser processing of BioMEMS and biosensors, Laser applications to medicine.

JOINT SESSION of LPM & HPL (JS)

SP J1) Advances in fiber and disk lasers and their novel applications to materials processing
Orgainzers: Friedrich Dausinger
(Stuttgart University, Germany); Isamu Miyamoto (Osaka University, Japan)

In the past few years, fiber and disk lasers have shown dramatic progress dueto their novel design concept, providing excellent beam quality at high power levels as well as long life time, compactness, high-efficiency and so on. These lasers are now replacing the existing lasers for materials processing,and laser materials processing in next generation will, without any doubt, depend on the progress and the competition of these two lasers.  LAMP2006will host a joint-special session of HPL and LPM to highlight the latest progress of development and applications of these two lasers.  Papers are solicited on the following topics for macro and micro fields: laser and system developments, technical and economical assessment of the laser system, laser-matter interaction fundamentals, their applications to welding, cutting, drilling, sintering, surface structuring and other potential newapplications.



ABSTRACT SUBMISSION
Submission Due Date: November 30, 2005 JST Extended to December 10, 2005 JST 

Please submit your abstract through Abstract Submission Page.
The Abstract Submission Form is available at Online Submission Page (click below).
Your abstract should be written on the Form. Abstract should include Paper Title, Author(s), Affiliation, Country and E-mail address of corresponding author followed by text. Abstract should be no more than one page, A4 letter size paper (210mm x297mm). A Figure/Table may be included. Please do not exceed the defined margins or length. Please do not use special characters or fonts except Times New Roman and symbol font in your submission form. If it is not possible to use the online style template, please directly contact LAMP2006 Office at teraoka@jlps.gr.jp
Go to Online Submission




ADVANCE PROGRAM
Advance Program [PDF]
( Revised as of May 10)
Session Chart [ PDF ] ( Revised as of May 2, LPM-11, LPM-16 Starting Time Revised))
Audio Vidual Equipments [PDF]( Revised as of Feb. 24 )
Poster Panel Size: Width 120cm x Height 210cm

To:  LAMP2006 Poster Presenters

“Short Presentation” is scheduled before Poster Session on May 16 and 17.  Due to the limited time schedule of the program, each presentation is for 3 minutes, and only overhead sheets are allowed as presentation materials for the Short Presentation.

If you would like to have an opportunity for 3-minutes presentation before the Poster Session, please fill out the following form, and e-mail back to us at teraoka@jlps.gr.jp by Friday, March 31. The nomination will be on a first come, first served basis.
Application Form for Short Presentation of Poster Session:
[ PDF, WORD ]


ONLINE-REGISTRATION

(JPY=Japanese Yen)

Early Registration Due Date: April 20, 2006 JST
(same as hotel reservation cut-off date)

Go to Online-Registration

Please input in English Only. In case of any inquiries in Japanese, please directly contact
LAMP2006 Office at teraoka@jlps.gr.jp

Registration Fee

JLPS MEMBER

NON-MEMBER

Early Registration
(by April 20, 2006)

Including
Technical Digest
Banquet
Online Proceedings

JPY 48,000-

JPY 54,000-

On-site Registration
Including
Technical Digest
Banquet
Online Proceedings

JPY 60,000-

JPY 65,000-

One-Day
Including Technical Digest

JPY 32,000-

Student
Including Technical Digest

JPY 12,000-

Banquet

  One-Day Participant

JPY 10,000-

  Student

 JPY 5,000-

  Accompanying Person with General Participant

 JPY 5,000-

  Accompanying Person with Invited Speaker

FREE- 


To Student Participant: Please bring your own student ID card issued by your universities with you
.

MANUSCRIPT SUBMISSION & ONLINE PROCEEDINGS
Submission Due Date: May 16, 2006 (On Site)
Download Manuscript Guidelines: [ PDF]
Download Copyright Transfer Form: [ PDF ]

Online Proceedings will be published after the congress. Full registration fee includes the online proceedings. Login name and Password will be provided to the participants with full registration.

PUBLICATION POLICY
Manuscript due dates must be strictly observed. Late manuscripts run the risk of not being published in the proceedings.


PAPER REVIEW
To ensure a high-quality conference, all submitted manuscripts will be reviewed by the Program Committee for technical merit.

If you are not the LAMP2006 participant with full registration and wish to access to the online proceedings, please send the request e-mail to the LAMP2006 Secretariat at teraoka@jlps.gr.jp
Special Access Fee Member Non-Member
JPY 2,500- JPY 4,500-
JPY= Japanese Yen


ONLINE JOURNAL
"JLMN-Journal of Laser Micro/Nanoengineering"


The authors have a chance to publish their proceedings manuscripts in Journal of Laser Micro/Nanoengineering.  The manuscripts will be peer reviewed. Authors who wish to submit their manuscripts to this Journal should check the box in the Copyright Transfer Form.  Then the submitted manuscript will be automatically passed to the review process.  The authors can suggest possible reviewers. If the authors have possible reviewers, please attach the list of at least three names, with full information on postal and e-mail addresses, telephone number, and fax number, to the Copyright Transfer Form.

Download Manuscript Guidelines for JLMN : [ PDF, WORD]
Publication Policy of JLMN : [ PDF ]
JLMN Website:  http://www.jlps.gr.jp/jlmn/


HOTEL RESERVATIONS
Reservation Cut-Off Date: April 20, 2006 JST
Go to Hotel Reservation Page


ACCESS to KYOTO
The Most Authentic and Traditional City of Japan

About “Kyoto”: http://web.kyoto-inet.or.jp/org/hellokcb/eng/index-e.htm
Access to “Kyoto”: http://www.krp.co.jp/english/access/index.html



AWARDS in the PAST

LPM2004 Award Winners: [PDF]
LPM2005 Award Winners: [PDF]




SPECIAL ACKNOWLEDGEMENT

We wish to thank AFOSR/AOARD for their kind contribution to the success of LAMP2006.
Air Force Office of Scientific Research (AFOSR
)
Asian Office of Aerospace Research and Development (AOARD)





Sponsors










ADVERTISEMENTS & TABLE-TOP EXHIBITIONS

Advertisement for Technical Digest (A4 sized, one-page, black & white) Sold-Out JPY 70,000-
Table-Top Exhibition (up to 20 booths) Sold-Out JPY 145,000-




TABLE-TOP EXHIBITORS
Please click each company logo, you can jump to the URL.


Booth #1 & #2: MARUBUN CORPORATION



Booth #3: Thales Laser Co., LTD.


Booth #4: OPTOSCIENCE, Inc.
http://www.optoscience.com


Booth #5 & #6: IMRA America, Inc.
Japanese URL: http://www.imra.co.jp




Booth #7: FT Okura Inc.






Booth #8: Kantum Electronics Co., Ltd.





Booth #9: IPG Photonics Japan Limited




Booth #10, #11 : JAPAN LASER CORPORATION



Booth #12 : Hakuto Co., Ltd.



Booth #13 : Spectra-Physics K.K.




Booth #14: INDECO, INC.




Booth #15: EXCEL TECHNOLOGY JAPAN


Booth #16: GADELIUS K.K.
http://www.gadelius.com



Booth #17: KATAOKA CORPORATION




Booth #18 & #19: Coherent Japan, Inc.




Booth #20: OPHIR JAPAN LTD.





TECHNICAL DIGEST ADVERTISERS:

OPHIR JAPAN LTD.




SIGMA KOKI CO., LTD.





TOKYO INSTRUMENTS, INC.



SHIMPO Corporation





Spectra-Physics K.K.




IMRA America, Inc.






MARUBUN CORPORATION




ROFIN-BAASEL JAPAN CORPORATION







SPECIAL THANKS to:
COFFEE BREAK SPONSOR

OPHIR JAPAN LTD.



CONGRESS BAG SPONSOR
MEGAOPTO




In COOPERATED with:

HTS- High Temperature Society of Japan
JSPE-The Japan Society for Precision Engineering
JWS-The Japan Welding Society
LIA-Laser Institute of America
LSJ-The Laser Society of Japan






ORGANIZING COMMITTEE

General Chair:  Isamu Miyamoto (Osaka Univ., Japan)
Co-Chairs: Koji Sugioka (RIKEN-The Institute of Physical and Chemical Research, Japan); Seiji Katayama (Osaka Univ., Japan); Henry Helvajian (The Aerospace Corporation, USA); Friedrich H. Dausinger (Univ. of Stuttgart, Institut fur Strahlwerkzeuge, IFSW, Germany); Kazuyoshi Itoh (Osaka Univ., Japan)
Members:
Ralf Eckhard Beyer (Fraunhofer IWS, Germany); Zhaogu Cheng (Shanghai Institute of Optics and Fine Mechanics, CAS, China); Paul E. Denney (EWI-Edison Welding Institute, USA); Jan J. Dubowski (Universite de Sherbrooke, Canada); Walter W. Duley (Univ. of Waterloo, Canada); Frederick Dylla (Thomas Jefferson National Accelerator Facility, USA); Keiji Ebata (Sumitomo Electric Industries, Ltd., Japan); Remy Fabbro (CLFA-Cooperation Laser Franco-Allemande, France); Burkhard Fechner (Lambda Physik AG, Germany); Kenshi Fukumitsu (Hamamatsu Photonics K.K., Japan); James Horwitz (U.S. Department of Energy, USA); Wen Hao Huang (Univ. of Science and Technology of China, China); Takashi Ishide(MITSUBISHI HEAVY INDUSTRIES, LTD., Japan); Shinichi Ishizaka (Japan Steel Works America, Inc., USA); Seiji Iwama (SHIBAURA MECHATRONICS CORPORATION, Japan); Teruyoshi Kadoya (TRUMPF Corporation, Japan); Kazuo Kamada (Matsushita Electric Works, Ltd., Japan); Hidehiko Karasaki (Matsushita Welding Systems Co., Ltd., Japan); Jeong-Ham Kim (KITECH-Korea Institute of Industrial Technology, South Korea); Akikazu Kitagawa (Hitachi Zosen Corporation, Japan); Kojiro F. Kobayashi (Osaka Univ., Japan); Vitali Konov (GPI- General Physics Institute, Russia); Ernest W. Kreutz (Lahrsturl fur Lasertechnik, RWTH-Aachen, Germany); Cheon Lee (Inha Univ., South Korea); Hiroshi Masuhara (Osaka Univ., Japan); Jyoti Mazumder (The Univ. of Michigan, USA); Hiroaki Misawa (Hokkaido Univ., Japan); Takashi Miyoshi (Osaka Univ., Japan); Kiyokazu Mori (NISSAN, Japan); Sumio Nakahara (Kansai Univ., Japan); Hirokuni Namba (Sumitomo Electric Industries, Ltd., Japan); Klaus Nowitzki (EOS-European Optical Society, Germany); Tatsuo Okada (Kyushu Univ., Japan); Moriaki Ono (JFE Steel Corporation, Japan); Andreas Ostendorf (Laser Zentrum Hannover e.V., Germany); Reinhart Poprawe (Lehrstuhl fur Lasertechnik, Germany); Shozui Takeno (Mitsubishi Electric Corporation, Japan); Frank Vollertsen (BIAS- Bremer Institut fur angewandte Strahltechnik, Germany); Osamu Wakabayashi (GIGAPHOTON INC., Japan); Takehiro Watanabe (Chiba Univ., Japan); Ken Watkins (Univ. of Liverpool, UK); Kozo Yasuda (Kawasaki Heavy Industries, Ltd., Japan)



LPM2006 PROGRAM COMMITTEE

Chairperson: Koji Sugioka (RIKEN-The Institute of Physical and Chemical Research, Japan)
Members: Carmen N. Afonso (Instituto de Optica, CSIC, Spain); Alan Arai (IMRA America, Inc., USA); David Ashkenasi (LMTB- Laser- u. Medizin Technologie GmbH Berlin, Germany); Sung-Hak Cho (Korea Institute of Machinery & Materials, South Korea); Corey M. Dunsky (Coherent Inc., USA); Gerd Esser (Leiter Zentrale Forschung und Innovation, Germany); Eric Fogarassy (CNRS-PHASE, France); Costas Fotakis (I.E.S.L.-Institute of Electronic Structure and Laser, F.O.R.T.H.-Foundation for Research and Technology-Hellas, Greece); Arnold Gillner (Fraunhofer-Institute for Laser Technology, Germany); Bo Gu (GSI Group, USA); Dennis R. Hall (Heriot-Watt Univ., UK); Peter R. Herman (Univ. of Toronto, Canada); Ingolf V. Hertel (Max-Born Institute for Nonlinear Optics and Short-Pulse Spectroscopy, Germany); Andrew S. Holmes (Imperial College, UK); Minghui Hong (Data Storage Institute, Singapore); Juergen Ihlemann (Laser Laboratory Goettingen, Germany); Yoshiro Ito (Nagaoka Univ. of Technology, Japan); Takahisa Jitsuno (Osaka Univ., Japan); Sylvain Lazare (Universite de Bordeaux 1, France); Thomas Lippert (Paul Scherrer Institut, Switzerland); Yong-Feng Lu (Univ. of Nebraska, USA); Shoji Maruo (Yokohama National Univ., Japan); Simeon Metev (BIAS-Bremen Institute of Applied Beam Technology, Germany); Michel Meunier (Ecole Polytechnique de Montreal, Canada); Yoshiki Nakata (Osaka Univ., Japan); Hiroyuki Niino (AIST-National Institute of Advanced Science and Technology, Japan); Jyunji Nishii (AIST-National Institute of Advanced Science and Technology, Kansai, Japan); Satoru Nishio (Ritsumeikan Univ., Japan); Etsuji Ohmura (Osaka Univ., Japan); Toshihiko Ooie (AIST-National Institute of Advanced Science and Technology, Japan); Alan B. Petersen (Spectra-Physics, Inc., USA); Alberto Pique (Naval Research Laboratory, USA); Juergen Reif (Brandenburg Univ. of Technology, Cottbus, Germany); Vadim Veiko (St. Petersburg State Univ. of Information Technologies, Russia); Kunihiko Washio (Paradigm Laser Research Ltd., Japan; Xianfan Xu (Purdue Univ., USA)



HPL2006 PROGRAM COMMITTEE

Chairperson: Seiji Katayama (Osaka Univ., JWRI-Joining and Welding Research Institute, Japan)
Members: Nobuyuki Abe (Osaka Univ., Japan); Berndt Brenner (IWS, Germany); Francis Briand (Air Liquide, France); Koji Fujii (Matsushita Welding Systems Co., Ltd., Japan); Akio Hirose (Osaka Univ., Japan); Alexander Kaplan (Lulea Univ. of Technology, Sweden); Aravinda Kar (Univ. of Central Florida, US); Jong-Do Kim (Korea Maritime Univ., South Korea); Veli Kujanpaa (Lappeenranta Univ. of Technology, Finland); Kazuhisa Mikame (Toyota Motor Corporation, Japan); Dirk Petring (Fraunhofer-Institute for Lasertechnology ILT, Germany); Susumu Tsukamoto (National Institute for Materials Science, Japan); Jay F. Tu (Univ. of South Carolina, USA); Keisuke Uenishi (Osaka Univ., Japan); Hiroto Yamaoka (IHI-Ishikawajima-Harima Heavy Industries Co., Ltd., Japan); Masanori Yasuyama (Sumitomo Metal Industries, Ltd., Japan)



STEERING COMMITTEE

Local Arrangement

Chairperson: Satoru Nishio (Ristumeiken Univ., Japan)
Vice Chairpersons:
Wataru Watanabe (AIST-National Institute of Advanced Science and Technology, Kansai, Japan); Yousuke Kawahito (Osaka Univ., Japan)
Members: Masaki Hashida (Kyoto Univ., Japan); Yoichiroh Hosokawa (Osaka Univ., CREST, Japan); Yasuhiro Takaya (Osaka Univ., Japan); Masahiro Tsukamoto (Osaka Univ., Japan); Yuka Yamada (Matsushita Electric Industrial Co., Ltd., Japan)
; Yoshiki Nakata (Osaka Univ., Japan)

Publicity

Chairperson: Hiroyuki Niino (AIST-National Institute of Advanced Science and Technology, Tsukuba, Japan)
Vice Chairperson:
Masami Mizutani
 (Osaka Univ., Japan)

Treasurer

Chairperson: Toshihiko Ooie (AIST-National Institute of Advanced Science and Technology, Japan)
Vice Chairperson: Yasuhiro Okamoto (Okayama Univ., Japan)
Members: Shinichi Goriki (Industrial Technology Center of Fukui Prefecture, Japan); Takanori Hino (Niihama National College of Technoloy, Japan)Akihiro Utsumi AIST-National Institute of Advanced Science and Technology, Japan

Exhibition

Chairperson: Takehiro Watanabe (Chiba Univ., Japan)
Vice Chairpersons: Hidehiko Karasaki (Matsushita Welding Systems Co., Ltd., Japan); Kunihiko Washio (Paradigm Laser Research Ltd., Japan)

Publication

Chairperson: Sumio Nakahara (Kansai Univ., Japan)
Vice Chairperson: Susumu Tsukamoto (National Institute for Materials Science, Japan)
Members: Yasunobu Miyazaki (Nippon Steel Corporation, Japan); Yoshihiro Okino (Kansai Univ., HRC, Japan); Hiroto Yamaoka (IHI-Ishikawajima-Harima Heavy Industries Co., Ltd., Japan)

Secretary

Chairperson: Etsuji Ohmura (Osaka Univ., Japan)
Vice Chairperson: Nobuyuki Abe (Osaka Univ., Japan)
Member: Kiyokazu Yasuda (Osaka Univ., Japan)


LINK

Japan Laser Processing Society (in Japanese)
http://www.jlps.gr.jp/
Photonics Spectra http://www.Photonics.com/spectra
http://www.laserglobalservices.com/
http://www.nanonet.go.jp/japanese/calendar/

http://www.nanonet.go.jp/english/index.html


http://www.www.lfw-japan.jp


LPM2007 First Announcement

April 24-28, 2007, University of Vienna, Vienna, Austria
[ PDF ]



CONTACT
JLPS- Japan Laser Processing Society, LAMP2006 Office
Address: c/o Katayama Lab., JWRI-Joining and Welding Research Institute,
Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
Tel/Fax:+81-6-6879-8642
E-mail:
Contact: Ms. Hiromi Teraoka