The 4th International Congress on Laser Advanced Materials Processing
LPM2006-The 7th International Symposium on Laser Precision Microfabrication
HPL2006-The 4th International Symposium on High Power Laser Processing
< LAST UPDATE: November 30, 2006 JST >
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Award Results
Advance Program
(Rev.5/14)
Addendum & Changes
IMPORTANT DATES
Abstract Submission Due Date: November 30, 2005 Extended to Dec. 10, 2005 JST
Early Online-Registratoin Due Date: April 20, 2006
Hotel Reservations Cut-Off Date: April 20, 2006
Manuscript Submission Due Date: May 16, 2006
(On-Site Submission)
AIMS and SCOPE
The International Congress on Laser Advanced Materials Processing (LAMP)
deals with science and technology of advanced laser materials processing
covering precision microfabrication and high power laser processing. Basically
LAMP is held every four years, and the former LAMPs have won the good reputation
and popularity as the one of the most excellent international meetings
in the world. LAMP 2006 is held during May 16-19, 2006, in Kyoto,
the ancient capital of Japan with the most authentic and traditional atmosphere.
LAMP 2006 consists of International Symposia on Laser Precision Microfabrication
(LPM) and High Power Laser Processing (HPL) and covers hardware as well
as software for fundamental research and industrial applications in both
micro and macro processing. LAMP 2006 is planned as a four-day event
with a plenary session, oral and poster sessions, special sessions dealing
with topical issues, and a table-top exhibition with inviting most important
world authorities in this field. The aim of this congress is to provide
a forum for discussion of fundamental aspects of laser-matter interaction,
the state-of-the-art of laser materials processing, and topics for the
next generation with fundamental scientists, end users and laser manufactures.
We expect that LAMP 2006 would play an important role not only for
understanding fundamental knowledge of laser materials processing but also
forecasting future technologies to be developed and the future laser market.
General Chair:
Isamu Miyamoto, Osaka University, Japan
Co-Chairs:
Koji Sugioka, RIKEN, Japan
Seiji Katayama, Osaka University, Japan
Henry Helvajian, The Aerospace Corporation, USA
Friedrich H. Dausinger, University of Stuttgart, IFSW, Germany
Kazuyoshi Itoh, Osaka University, Japan
Organizers:
JLPS-Japan Laser Processing Society, Japan
AIST-National Institute of Advanced Industrial Science and Technology,
Japan
RIKEN-The Institute of Physical and Chemical Research, Japan
Kinkaku-ji Temple Ryuan-ji Temple (Zen
Rock Garden) Maiko (apprentice geisha)
Photo©Kyoto Convention Bureau
LPM2006 TOPICS
| 01 |
Fundamental aspects (Dynamics, modeling, simulation, etc.)
|
15 |
Marking and trimming |
| 02 |
Process monitoring and control |
16 |
Packaging and mounting process |
| 03 |
Laser- and photochemistry |
17 |
Lithography (including EUV source and application) |
| 04 |
Nanotechnology |
18 |
Manufacturing of micro devices and systems |
| 05 |
Ultra-short pulse laser processing |
19 |
Film deposition and synthesis of advanced materials (PLD, CVD, etc.) |
| 06 |
VUV laser and x-ray processing |
20 |
Nanomaterials synthesis |
| 07 |
Surface treatment (Texuring, cleaning, annealing, modification, etc.) |
21 |
Optics and systems for laser micro- and nano-processing |
| 08 |
Micro-patterning and micro-structuring |
22 |
Laser devices |
| 09 |
Micro-machining |
23 |
Industrial applications |
| 10 |
3-D micro- and nano-fabrication |
24 |
Special Session L1: (SP L1)
The future of ultrashort laser manufacturing |
| 11 |
Micro drilling and cutting |
25 |
Special Session L2: (SP L2)
Laser-based direct-write techniques |
| 12 |
Micro welding and bonding |
26 |
Special Session L3: (SP L3)
Laser micro/nano-engineering for biomedical applications |
| 13 |
Micro forming |
27 |
Others |
| 14 |
Wafer dicing |
HPL2006 TOPICS (Revised as of Nov.10)
| 01 |
Fundamentals of laser-materials interactions |
14 |
Hybrid welding |
| 02 |
Laser-induced plasma |
15 |
Laser welding of light metals |
| 03 |
Process sensing, monitoring and control |
16 |
Welding imperfection and defects |
| 04 |
Modeling and simulation |
17 |
Materials removal (Cutting, drilling, etc.) |
| 05 |
Materials and metallurgical aspects |
18 |
Surface modification and fabrication
(Quenching, alloying, cleaning, etc.) |
| 06 |
Evaluation of properties
(Strength, etc.) |
19 |
Cladding |
| 07 |
Laser systems (Remote control, etc.) |
20 |
Rapid prototyping |
| 08 |
Gas laser |
21 |
Forming and shaping |
| 09 |
Solid-state laser |
22 |
New and innovatice applications (Sandwich panel, etc.) |
| 10 |
High power laser diode |
23 |
Applications (Automobiles, ship,
trains, airplanes, etc.) |
| 11 |
LD-pumped solid laser |
24 |
Applications (Steel, motors,
parts, nuclear fields, etc.) |
| 12 |
Optics and beam delivery systems |
25 |
Present status and future prospects |
| 13 |
Welding and brazing |
26 |
Others |
JOINT SESSION of LPM & HPL (JS)
| 01 |
Crossover regions of LPM & HPL |
| 02 |
Special Session J1: (SP J1)
Advances in fiber and disk lasers and their novel applications to materials
processing |
PLENARY TALKS
Eckhard Beyer (Fraunhofer IWS, Dresden, Germany):
Laser macro processing - Today and tomorrow
Eric Mazur (Harvard University, USA):
Femtosecond laser micro and nano engineering for photonics and biology
Koji Yasui (Mitsubishi Electric Corporation, Japan):
Laser developments for macro and micro demands
INVITED SPEAKERS for LPM2006
Special Session L1: (SP L1)
The future of ultrashort laser manufacturing
Man Seop Lee (PHOCO Company, South Korea):
Femtosecond laser-assited micro-machining for display panel and optical
device applications
Ralf Knappe (Lumera Laser, Germany):
Picosecond lasers for manufacturing
Special Session L2: (SP L2)
Laser-based direct-write techniques
Boris Chichkov (Laser Zentrum Hannover e.V., Germany):
2D and 3D photofabrication with fs lasers for applications in photonics
and biomedicine
Frank Livingston (The Aerospace Corporation, USA):
Tailoring light pulses for optimal laser processing and material modification
applications
Pere Serra (University of Barcelona, Spain):
Laser-induced forward transfer: a direct writing technique for biosensors
preparation
Special Session L3: (SP L3)
Laser micro/nano-engineering for biomedical applications
Alfred Vogel (Institute of Biomedical Optics, Unversity of Lubeck, Germany):
Femtosecond laser nanosurgery of biological cellls and tissues
Benoit Simard (Steacie Institute for Molecular Sciences, Canada):
Laser-assisted preparation and characterization of core-shell Fe@Au nanoparticules
for biological applications
Shunichi Sato (National Defense Medical College, Japan):
Targeted gene transfection by the use of laser-induced stress wave
Fundamentals and Theoretical Approach
Nadezda Bulgakova (Institute of Thermophysics, Russia):
Theoretical models and qualitative interpretations of fs-laser material
processing
Nanostructuring
Samuel S. Mao (Lawrence Berkeley National Laboratory, USA):
Photonic semiconductor one-dimensional nanostructures fabricated by fs
lasers
Laser-and Photochemistry
Stavros Pissadakis (IESL-FORTH, Greece):
Deep UV radiation induced photodissociative processes in transparent optical
materials: index engineering and structural modification effects
Analytical Application
Eric Mottay (Amplitude Systemes, France):
Femtosecond laser applications in analytical chemistry
Advanced Material Synthesis
Shojiro Komatsu (Advanced Materials LaboratoryNational Institute for Materials Science, Japan):
Sp3-bonded 5H-BN films grown by plasma-assisted laser CVD for electron
field emitter applications: its growth mechanism and the FE properties
Simeon Metev (BIAS-Bremer Institut fuer Angewandte Strahltechnik, Germany):
Laser-induced high-rate photon plasma CVD synthesis of diamond coatings
in air
Glass/Ceramics Processing
Heinrich Graener (Matin-Luther-University Halle-Wittenberg, Germany):
Structuring of nanocomposite glass using femtosecond lasers
Organic Material Processing
Horst-Guenter Rubahn (Fysisk Institut, Syddansk Universitet, Denmark):
UV-laser forming of organic nanoaggregates and polymeric films
Micromachining
Andreas Ostendorf (Laser Zentrum Hannover e.V., Germany):
Metal and Polymer Microparts Generated by Laser Rapid Prototyping
Assembling of Microcomponents
Natallia Karlitskaya (Philips Applied Technologies, The Netherlands):
Laser-assisted micro components assembly: releasing control and placement
accuracy improvement investigation
Laser Applications in Industry
Adrian Boyle (Xsil Limited, Ireland):
Advanced laser machining technology and systems for semiconductor manufacturing
Takashi Shindo (Matsushita Electric Works, Ltd., Japan):
Laser patterning method with dynamic focus control
INVITED SPEAKERS for HPL2006
Zhaogu Cheng (Shanghai Institute of Optics and Fine Mechanics, CAS, China):
Study on hybrid laser welding with novel self-adaptive optical device for
shipbuilding applications
Remmy Fabbro (LALP (CNRS) / GIP GERAILP, France):
Dynamic control of melt pool behavior using gas jet during CW Nd-Yag laser
welding
Paul Hilton (TWI Ltd., UK):
The effect of spot size and beam parameter product when welding aluminium
and steel with high power fibre delivered laser beams
Ernst Wolfgang Kreutz (Fraunfoher-Institute fuer Lasertechnik, Germany):
Laser metal deposition- A powerful tool for turbo machinery
Veli Kujanpää (Lappeenranta University of Technology, Finland):
R & D activities and specific industrial applications of laser processing
in Finland
Jyoti Mazumder (The University of Michigan, USA):
A novel method for lap welding of automotive sheet steel using high power
CW CO2 Laser
Dirk Petring (Fraunhofer Institute for Laser Technology, Germany):
Enhancing laser system flexibility with the combi-head for cutting and
joining
Paul Denney (The Edison Welding Institute, USA):
High power fiber lasers and their potential impact on manufacturing
Friedrich Dausinger (Institut fuer Strahlwerkzeuge, IFSW, Germany):
Diagnostic and prevenstion of laser wald defects
INVITED SPEAKERS for JOINT SESSION of LPM & HPL (JS)
Frank Vollertsen (BIAS-Bremer Institut fuer Angewandte Strahltechnik, Germany):
Fiber laser welding - Basic investigations and application studies
Adolf Giesen (University of Stuttgart, IFSW-Institut fuer Strahlwerkzeuge, Germany):
Potential of disk lasers (Tentative)
Kurt Mann (Trumpf Laser GmbH, Germany):
High power disk lasers and their applications
David Payne (SPI, UK):
Potential of fiber lasers (Tentative)
Hans-Juergen Kahlert (Jenoptik, Germany):
High power, high repetition rate green q-switched lasers for annealing
applications
Seiji Katayama (Osaka University, Japan):
Laser-assisted metal and plastic (LAMP) joining
Reinhart Poprawe (Fraunhofer Institute for Laser Technology, Germany):
Prospective of laser macro processing
SPECIAL SESSIONS of LPM2006
SP L1) The future of ultrashort laser manufacturing
Organizer: Peter Herman (University of Toronto, Canada)
Ultrashort lasers have slowly evolved into reliable sources that now present unique opportunities for manufacturing applications. When are ultrashort pulses advantageous? Is picosecond duration enough? In this session, industry speakers address the utility of both picosecond and femtosecond lasers in manufacturing by examining:
- the reliability of new ultrafast laser systems,
- benefits of picosecond and femtosecond interactions,
- the merits of pulse shaping and repetition rate,
- the industrial forefront in nanofabrication,
- successful commercial applications of ultrashort lasers.
SP L2) Laser-based direct-write techniques
Organizers: Alberto Pique (Naval Research Laboratory, USA); Andreas Ostendorf (Laser Zentrum Hannover, Germany); Craig Arnold (Princeton University, USA)
In
the past few years, significant progress has been made in the use of lasers for
direct-write applications. Laser-based direct-write techniques offer the ability
to perform ablation, transfer or modification of virtually any type of material
or surface in a point-wise fashion, opening the opportunity for the fabrication
of novel structures or devices. LPM 2006 will host a special session in laser
direct-write to explore the latest developments in this expanding area. Papers
are solicited in the use of laser direct-write techniques for electronic,
photonic, microfluidic, sensing and biomedical applications. This session will
also accept contributions in the use of ultrafast lasers for direct-write,
fabrication of 3-D microstructures, materials development for laser
direct-write and studies of the fundamental mechanisms responsible for the
process.
SP L3) Laser micro/nano-engineering for biomedical applications
Organizer: Michel Meunier (Ecole Polytechnique de Montreal, Canada)
The
use of lasers for microprocessing biological and biocompatible materials is now
becoming an established enabling technology and various industrial and medical
applications are emerging at an increasing rate. This special session will focused on the
development and modeling of new laser processing of biological and
biocompatible materials. Papers are solicited on, but not limited to, the
following topics within the broad area of biomedical applications: fundamental
aspects and modeling of laser-biomaterials and tissue interaction (from cw to
fs time scales and from VUV to IR); laser modification, cleaning and texturing
of biomaterials; Pulsed laser deposition, laser pattern transfer, laser-induced
forward transfer, and direct-write of biocompatible thin films; Diagnostics for
in situ laser microprocessing for biomedical applications; Laser
micro-engineering and nano-engineering of biomaterials and nanomaterials; Laser
processing of BioMEMS and biosensors, Laser applications to medicine.
JOINT SESSION of LPM & HPL (JS)
SP J1) Advances in fiber and disk lasers and their novel applications to
materials processing
Orgainzers: Friedrich Dausinger (Stuttgart University, Germany); Isamu Miyamoto (Osaka University, Japan)
In the past few years, fiber and disk lasers have shown dramatic progress
dueto their novel design concept, providing excellent beam quality at high
power levels as
well as long life time, compactness, high-efficiency and so on. These lasers are now replacing the existing lasers for materials processing,and
laser materials processing in next generation will, without any doubt, depend on
the progress and the competition of these two lasers. LAMP2006will host a joint-special session of HPL and LPM to highlight the
latest progress of development and applications of these two lasers. Papers are solicited
on the following topics for macro and micro fields: laser and system
developments, technical and economical assessment of the laser system, laser-matter
interaction fundamentals, their applications to welding, cutting, drilling, sintering, surface structuring and other potential
newapplications.
ABSTRACT SUBMISSION
Submission Due Date: November 30, 2005 JST Extended to December 10, 2005 JST
Please submit your abstract through Abstract Submission Page.
The Abstract Submission Form is available at Online Submission Page (click
below).
Your abstract should be written on the Form. Abstract should include Paper
Title, Author(s), Affiliation, Country and E-mail address of corresponding
author followed by text. Abstract should be no more than one page, A4 letter
size paper (210mm x297mm). A Figure/Table may be included. Please do not
exceed the defined margins or length. Please do not use special characters
or fonts except Times New Roman and symbol font in your submission form.
If it is not possible to use the online style template, please directly
contact LAMP2006 Office at teraoka@jlps.gr.jp
Go to Online Submission
ADVANCE PROGRAM
Advance Program [PDF] ( Revised as of May 10)
Session Chart [ PDF ] ( Revised as of May 2, LPM-11, LPM-16 Starting Time Revised))
Audio Vidual Equipments [PDF]( Revised as of Feb. 24 )
Poster Panel Size: Width 120cm x Height 210cm
To: LAMP2006 Poster Presenters
“Short
Presentation” is scheduled before Poster Session on May 16 and 17. Due
to the limited time schedule of the program, each presentation is for 3
minutes, and only overhead sheets are allowed as presentation materials for the
Short Presentation.
If you would like to have an opportunity for 3-minutes presentation before
the Poster Session, please fill out the following form, and e-mail back
to us at teraoka@jlps.gr.jp
by Friday, March 31. The nomination will be on a first come, first served basis.
Application Form for Short Presentation of Poster Session: [ PDF, WORD ]
ONLINE-REGISTRATION
(JPY=Japanese Yen)
Early Registration Due Date: April 20, 2006 JST
(same as hotel reservation cut-off date)
Go to Online-Registration
Please input in English Only. In case of any inquiries in Japanese, please
directly contact
LAMP2006 Office at teraoka@jlps.gr.jp
|
Registration Fee
|
JLPS MEMBER
|
NON-MEMBER
|
|
Early Registration
(by April 20, 2006)
Including
Technical Digest
Banquet
Online Proceedings
|
JPY 48,000- |
JPY 54,000-
|
On-site Registration
Including
Technical Digest
Banquet
Online Proceedings |
JPY 60,000-
|
JPY 65,000-
|
|
One-Day
Including Technical Digest
|
JPY 32,000-
|
|
Student
Including Technical Digest
|
JPY 12,000-
|
|
Banquet
|
One-Day Participant
|
JPY 10,000-
|
|
Student
|
JPY 5,000-
|
|
Accompanying Person with General Participant
|
JPY 5,000-
|
|
Accompanying Person with Invited Speaker
|
FREE-
|
To Student Participant: Please bring your own student ID card issued by
your universities with you.
MANUSCRIPT SUBMISSION & ONLINE PROCEEDINGS
Submission Due Date: May 16, 2006 (On Site)
Download Manuscript Guidelines: [ PDF]
Download Copyright Transfer Form: [ PDF ]
Online Proceedings will be published after the congress. Full registration
fee includes the online proceedings. Login name and Password will be provided
to the participants with full registration.
PUBLICATION POLICY
Manuscript due dates must be strictly observed. Late manuscripts run the risk of not being published in the proceedings.
PAPER REVIEW
To ensure a high-quality conference, all submitted manuscripts
will be reviewed by the Program Committee for technical merit.
| If you are not the LAMP2006 participant with full registration and wish
to access to the online proceedings, please send the request e-mail to
the LAMP2006 Secretariat at teraoka@jlps.gr.jp |
| Special Access Fee |
Member |
Non-Member |
| JPY 2,500- |
JPY 4,500- |
JPY= Japanese Yen
ONLINE JOURNAL
"JLMN-Journal of Laser Micro/Nanoengineering"
The authors have a chance to publish their proceedings manuscripts in Journal
of Laser Micro/Nanoengineering. The manuscripts will be peer reviewed.
Authors who wish to submit their manuscripts to this Journal should check the
box in the Copyright Transfer Form. Then
the submitted manuscript will be automatically passed to the review
process. The authors can suggest possible reviewers. If the authors have possible
reviewers, please attach the list of at least three names, with full information
on postal and e-mail addresses, telephone number, and fax number, to the
Copyright Transfer Form.
Download Manuscript Guidelines for JLMN : [ PDF, WORD]
Publication Policy of JLMN : [ PDF ]
JLMN Website: http://www.jlps.gr.jp/jlmn/
HOTEL RESERVATIONS
Reservation Cut-Off Date: April 20, 2006 JST
Go to Hotel Reservation Page
ACCESS to KYOTO
The Most Authentic and Traditional City of Japan
About “Kyoto”: http://web.kyoto-inet.or.jp/org/hellokcb/eng/index-e.htm
Access to “Kyoto”: http://www.krp.co.jp/english/access/index.html
AWARDS in the PAST
LPM2004 Award Winners: [PDF]
LPM2005 Award Winners: [PDF]
SPECIAL ACKNOWLEDGEMENT
We wish to thank AFOSR/AOARD for their kind contribution to the success
of LAMP2006.
Air Force Office of Scientific Research (AFOSR)
Asian Office of Aerospace Research and Development (AOARD)
Sponsors
ADVERTISEMENTS & TABLE-TOP EXHIBITIONS
| Advertisement for Technical Digest (A4 sized, one-page, black & white) Sold-Out |
JPY 70,000- |
| Table-Top Exhibition (up to 20 booths) Sold-Out |
JPY 145,000- |
TABLE-TOP EXHIBITORS
Please click each company logo, you can jump to the URL.
Booth #1 & #2: MARUBUN CORPORATION
Booth #3: Thales Laser Co., LTD.
Booth #4: OPTOSCIENCE, Inc.
http://www.optoscience.com
Booth #5 & #6: IMRA America, Inc.
Japanese URL: http://www.imra.co.jp
Booth #7: FT Okura Inc.
Booth #8: Kantum Electronics Co., Ltd.
Booth #9: IPG Photonics Japan Limited
Booth #10, #11 : JAPAN LASER CORPORATION
Booth #12 : Hakuto Co., Ltd.
Booth #13 : Spectra-Physics K.K.
Booth #14: INDECO, INC.
Booth #15: EXCEL TECHNOLOGY JAPAN
Booth #16: GADELIUS K.K.
http://www.gadelius.com
Booth #17: KATAOKA CORPORATION
Booth #18 & #19: Coherent Japan, Inc.
Booth #20: OPHIR JAPAN LTD.
TECHNICAL DIGEST ADVERTISERS:
OPHIR JAPAN LTD.
SIGMA KOKI CO., LTD.
TOKYO INSTRUMENTS, INC.
SHIMPO Corporation
Spectra-Physics K.K.
IMRA America, Inc.
MARUBUN CORPORATION
ROFIN-BAASEL JAPAN CORPORATION
SPECIAL THANKS to:
COFFEE BREAK SPONSOR
OPHIR JAPAN LTD.
CONGRESS BAG SPONSOR
MEGAOPTO
In COOPERATED with:
HTS- High Temperature Society of Japan
JSPE-The Japan Society for Precision Engineering
JWS-The Japan Welding Society
LIA-Laser Institute of America
LSJ-The Laser Society of Japan
ORGANIZING COMMITTEE
General Chair: Isamu Miyamoto (Osaka Univ., Japan)
Co-Chairs: Koji
Sugioka (RIKEN-The Institute of Physical and Chemical Research, Japan); Seiji Katayama (Osaka Univ., Japan); Henry Helvajian (The Aerospace Corporation, USA); Friedrich H. Dausinger (Univ. of Stuttgart,
Institut fur Strahlwerkzeuge, IFSW,
Germany); Kazuyoshi Itoh (Osaka Univ., Japan)
Members: Ralf Eckhard Beyer (Fraunhofer IWS, Germany); Zhaogu Cheng (Shanghai Institute of Optics and Fine Mechanics, CAS, China); Paul E. Denney (EWI-Edison Welding Institute, USA); Jan J. Dubowski (Universite de Sherbrooke, Canada); Walter W. Duley (Univ. of Waterloo, Canada); Frederick Dylla (Thomas Jefferson National Accelerator Facility, USA); Keiji Ebata (Sumitomo Electric Industries, Ltd., Japan); Remy Fabbro (CLFA-Cooperation Laser Franco-Allemande, France); Burkhard Fechner (Lambda Physik AG, Germany); Kenshi Fukumitsu (Hamamatsu Photonics K.K., Japan); James Horwitz (U.S. Department of Energy, USA); Wen Hao Huang (Univ. of Science and Technology of China, China); Takashi Ishide(MITSUBISHI HEAVY INDUSTRIES, LTD., Japan); Shinichi Ishizaka (Japan Steel Works America, Inc., USA); Seiji
Iwama (SHIBAURA
MECHATRONICS CORPORATION, Japan); Teruyoshi Kadoya (TRUMPF Corporation, Japan); Kazuo Kamada (Matsushita Electric Works, Ltd., Japan); Hidehiko Karasaki (Matsushita Welding Systems Co., Ltd., Japan); Jeong-Ham Kim (KITECH-Korea Institute of Industrial Technology, South Korea); Akikazu Kitagawa (Hitachi Zosen Corporation, Japan); Kojiro F. Kobayashi (Osaka Univ., Japan); Vitali Konov (GPI- General Physics Institute, Russia); Ernest W. Kreutz (Lahrsturl fur Lasertechnik, RWTH-Aachen, Germany); Cheon Lee (Inha Univ., South Korea); Hiroshi Masuhara (Osaka Univ., Japan); Jyoti Mazumder (The Univ. of Michigan, USA); Hiroaki Misawa (Hokkaido Univ., Japan); Takashi Miyoshi (Osaka Univ., Japan); Kiyokazu Mori (NISSAN, Japan); Sumio Nakahara (Kansai Univ., Japan); Hirokuni Namba (Sumitomo
Electric Industries, Ltd., Japan); Klaus Nowitzki (EOS-European Optical Society, Germany); Tatsuo Okada (Kyushu Univ., Japan); Moriaki Ono (JFE Steel Corporation, Japan); Andreas Ostendorf (Laser Zentrum Hannover e.V., Germany); Reinhart Poprawe (Lehrstuhl fur Lasertechnik, Germany); Shozui Takeno (Mitsubishi Electric Corporation, Japan); Frank Vollertsen (BIAS- Bremer Institut fur angewandte Strahltechnik, Germany); Osamu Wakabayashi (GIGAPHOTON INC., Japan); Takehiro Watanabe (Chiba Univ., Japan); Ken Watkins (Univ. of Liverpool, UK); Kozo Yasuda (Kawasaki Heavy Industries, Ltd., Japan)
LPM2006 PROGRAM COMMITTEE
Chairperson: Koji Sugioka (RIKEN-The Institute of Physical
and Chemical Research, Japan)
Members: Carmen N. Afonso
(Instituto de Optica, CSIC, Spain); Alan
Arai (IMRA America, Inc., USA); David
Ashkenasi (LMTB- Laser- u. Medizin Technologie GmbH
Berlin, Germany); Sung-Hak Cho
(Korea Institute of Machinery & Materials, South Korea); Corey M. Dunsky (Coherent Inc., USA); Gerd Esser (Leiter Zentrale Forschung
und Innovation, Germany); Eric Fogarassy
(CNRS-PHASE, France); Costas Fotakis
(I.E.S.L.-Institute of Electronic Structure and Laser, F.O.R.T.H.-Foundation
for Research and Technology-Hellas, Greece); Arnold Gillner (Fraunhofer-Institute for Laser Technology,
Germany); Bo Gu (GSI Group, USA); Dennis R. Hall (Heriot-Watt Univ., UK);
Peter R. Herman (Univ. of Toronto,
Canada); Ingolf V. Hertel (Max-Born
Institute for Nonlinear Optics and Short-Pulse Spectroscopy, Germany); Andrew S. Holmes (Imperial College,
UK); Minghui Hong (Data Storage
Institute, Singapore); Juergen Ihlemann
(Laser Laboratory Goettingen, Germany); Yoshiro
Ito (Nagaoka Univ. of Technology, Japan); Takahisa Jitsuno (Osaka Univ., Japan); Sylvain Lazare (Universite de Bordeaux 1, France); Thomas Lippert (Paul Scherrer Institut,
Switzerland); Yong-Feng Lu (Univ. of
Nebraska, USA); Shoji Maruo
(Yokohama National Univ., Japan); Simeon
Metev (BIAS-Bremen Institute of Applied Beam Technology, Germany); Michel Meunier (Ecole Polytechnique de
Montreal, Canada); Yoshiki Nakata (Osaka Univ., Japan); Hiroyuki Niino
(AIST-National Institute of Advanced Science and Technology, Japan); Jyunji Nishii (AIST-National Institute
of Advanced Science and Technology, Kansai, Japan); Satoru Nishio (Ritsumeikan Univ., Japan); Etsuji Ohmura (Osaka Univ., Japan); Toshihiko Ooie (AIST-National Institute of Advanced Science and
Technology, Japan); Alan B. Petersen
(Spectra-Physics, Inc., USA); Alberto Pique
(Naval Research Laboratory, USA); Juergen
Reif (Brandenburg Univ. of Technology, Cottbus, Germany); Vadim Veiko (St. Petersburg State Univ.
of Information Technologies, Russia); Kunihiko
Washio (Paradigm Laser Research Ltd., Japan; Xianfan Xu (Purdue Univ., USA)
HPL2006 PROGRAM COMMITTEE
Chairperson:
Seiji
Katayama (Osaka Univ.,
JWRI-Joining and Welding Research Institute, Japan)
Members:
Nobuyuki
Abe (Osaka Univ., Japan); Berndt
Brenner (IWS, Germany); Francis
Briand (Air Liquide, France); Koji
Fujii (Matsushita Welding Systems Co., Ltd., Japan); Akio Hirose (Osaka Univ., Japan); Alexander Kaplan (Lulea Univ. of Technology, Sweden); Aravinda Kar (Univ. of Central Florida,
US); Jong-Do Kim (Korea Maritime
Univ., South Korea); Veli Kujanpaa
(Lappeenranta Univ. of Technology, Finland); Kazuhisa Mikame (Toyota Motor Corporation, Japan); Dirk Petring (Fraunhofer-Institute for
Lasertechnology ILT, Germany); Susumu
Tsukamoto (National Institute for Materials Science, Japan); Jay F. Tu (Univ. of South Carolina, USA); Keisuke Uenishi (Osaka Univ., Japan); Hiroto Yamaoka (IHI-Ishikawajima-Harima Heavy Industries Co., Ltd.,
Japan); Masanori Yasuyama (Sumitomo
Metal Industries, Ltd., Japan)
STEERING COMMITTEE
Local Arrangement
Chairperson: Satoru Nishio
(Ristumeiken Univ., Japan)
Vice Chairpersons: Wataru
Watanabe (AIST-National Institute of Advanced Science and Technology, Kansai, Japan);
Yousuke Kawahito (Osaka Univ., Japan)
Members: Masaki Hashida
(Kyoto Univ., Japan); Yoichiroh Hosokawa (Osaka Univ., CREST, Japan); Yasuhiro Takaya
(Osaka Univ., Japan); Masahiro Tsukamoto
(Osaka Univ., Japan); Yuka Yamada (Matsushita
Electric Industrial Co., Ltd., Japan); Yoshiki Nakata (Osaka Univ., Japan)
Publicity
Chairperson: Hiroyuki Niino (AIST-National Institute of Advanced Science and Technology, Tsukuba, Japan)
Vice Chairperson: Masami Mizutani (Osaka
Univ., Japan)
Treasurer
Chairperson:
Toshihiko Ooie (AIST-National Institute of Advanced Science and Technology, Japan)
Vice
Chairperson: Yasuhiro
Okamoto
(Okayama Univ., Japan)
Members: Shinichi Goriki (Industrial Technology
Center of Fukui Prefecture, Japan); Takanori Hino (Niihama National
College of Technoloy, Japan)； Akihiro Utsumi （AIST-National Institute of Advanced Science and Technology,
Japan）
Exhibition
Chairperson: Takehiro Watanabe (Chiba
Univ., Japan)
Vice
Chairpersons: Hidehiko
Karasaki
(Matsushita Welding Systems Co., Ltd., Japan); Kunihiko Washio (Paradigm Laser Research Ltd., Japan)
Publication
Chairperson:
Sumio Nakahara (Kansai
Univ., Japan)
Vice
Chairperson: Susumu
Tsukamoto
(National Institute for Materials Science, Japan)
Members: Yasunobu Miyazaki (Nippon Steel
Corporation, Japan); Yoshihiro Okino
(Kansai Univ., HRC, Japan); Hiroto
Yamaoka (IHI-Ishikawajima-Harima Heavy Industries
Co., Ltd., Japan)
Secretary
Chairperson:
Etsuji Ohmura (Osaka Univ., Japan)
Vice
Chairperson: Nobuyuki Abe
(Osaka Univ., Japan)
Member:
Kiyokazu Yasuda (Osaka Univ., Japan)
LINK
LPM2007 First Announcement
April 24-28, 2007, University of Vienna, Vienna, Austria
[ PDF ]
CONTACT
JLPS- Japan Laser Processing Society, LAMP2006 Office
Address: c/o Katayama Lab., JWRI-Joining and Welding Research Institute,
Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka, 567-0047, Japan
Tel/Fax:+81-6-6879-8642
E-mail: 
Contact: Ms. Hiromi Teraoka
