LPM2017 Special Sessions
SS1：Lasers and nanoparticles in liquids
Stephan Barcikowski, University of Duisburg-Essen, Technical Chemistry and Center for Nanointegration Duisburg-Essen CENIDE, Germany
Vincenzo Amendola, University of Padova, Italy
Weiping Cai, Cinese Academy of Science, Hefei, PRC
Naoto Koshizaki, Hokkaido University, Japan
Hiroyuki Wada, Tokyo Institute of Technology, Japan
As a novel synthesis route, nanoparticle generation by lasers in liquids has proven its capability to generate and conjugate totally ligand-free colloidal nanoparticle building blocks. Recent studies highlight unique properties of laser-generated nanoparticles potentially harvested in real-world applications. At the same time, the community discovered novel process routes and describe unique material properties yielded by this exceptional, scalable synthesis method.
SS2：Optimisation of laser ablation processes using ultrashort pulse lasers
Gediminas Račiukaitis, Center for Physical Sciences and Technology (FTMC), Lithuania
Beat Neuenschwander, Bern University of Applied Sciences (BUAS), Switzerland
Nowadays industrial ready ultrashort pulsed laser systems are available but the photon energy of picosecond or femtoseconds lasers is still expensive, and therefore its efficient utilisation is a key factor for a wider spread of ultrashort pulsed lasers in real industrial applications. There are few opportunities for efficient processes under investigation as e.g. burst mode processing, multi-wavelength or multi-spot processing, or optimisation of laser fluence, scanning speed and pulse repetition rate to properties of the particular material, etc. We expect that newest results of those processes and also new approaches will be presented and discussed in the special session, including opinion and experience from industry.
SS3：Laser processes for packaging of high power electronics and energy storage systems
Arnold Gillner, Fraunhofer-Institut für Lasertechnik ILT, Germany
Yasuhiro Okamoto, Okayama University, Japan
Energy storage systems as well as high power electronics are widely required for electro mobility and regenerative energy. Among other material related technologies packaging of the components is of of the most important issues, since long time stability and reliability of interconnections and packages are required. Laser joining can fulfill the industrial specifications as long high quality processes and systems are used. Moreover new joining and packaging approaches are required which can meet future application conditions. Related papers and presentations should give insight into this new processes but also on improving current technologies.