[Plenary Speakers] (As of March 28)

Andrés Fabian Lasagni

Fraunhofer IWS, Dresden,

Technische Universitat Dresden, Germany

"High-speed surface structuring using Direct Laser Interference Patterning - fundamentals, applications and technology transfer”

Takunori Taira

Laser Research Center, Institute for Molecular Science (IMS), Japan

"Giant Micro-photonics for Ubiquitous Power Lasers”"

Xiang Zhang

University of California, Berkeley, USA

"Photonics beyond diffraction limit"

[Invited Speakers for Regular Sessions]

Richard M. Carter

Heriot-Watt University, UK

"Anti-resonant fibres for flexible high peak-power beam delivery"

Marti Duocastella

Nanophysics Department, Istituto Italiano di Tecnologia, Italy

"Laser direct printing of micro-optical elements"

Arnold Gillner

Fraunhofer-Institut für Lasertechnik ILT, Germany

"Laser micro and nanoprocessing: Current trends and future prospects"

Clemens Hönninger

Amplitude Systèmes, France

"Femtosecond laser architecture for high throughput industrial machining"

Fatih Ömer Ilday

Department of Electrical and Electronics Engineering, Bilkent University, Turkey

"Nonlinear Laser Lithography, going from 2D to 3D"

Nam Seong Kim

EO Technics Co., Ltd., Republic of Korea

"Overview on ultrafast laser applications and relevant markets in microelectronics industry"

Ion N. Mihailescu

National Institute for Lasers, Plasma and Radiation Physics

Lasers Department, "Laser-Surface-Plasma Interactions" Laboratory, Romania

"Biofabrication of thin layers and nanoparticles under controlled pulsed laser irradiation"

Beat Neuenschwander

Bern University of Applied Sciences

Institute for Applied Laser, Photonics and Surface Technologies ALPS, Switzerland

"Laser micromachining of metals with ultra-short pulses: Factors limiting the scale-up process"

Lars Penning

Next Scan Technology, Belgium

"Polygon scanner systems for laser microprocessing"

Alberto Piqué

US Naval Research Laboratory, USA

"Laser Printing Using Spatially Modulated Pulses"

Masaaki Sakakura

Kyoto University, Japan

"Stress dynamics in ultrashort pulse laser processing inside transparent materials"

Airán Ródenas Seguí

Istituto di Fotonica e Nanotecnologie (IFN) - Consiglio Nazionale delle Ricerche (CNR)

Dipartimento di Fisica - Politecnico di Milano, Italy

"Mid-infrared surface sensing waveguides in silica glass: Monitoring of water microstructure and contaminants"

Collin L. Sones

University of Southampton, UK

"Laser-based methodologies for point-of-care diagnostics devices on paper"

Testuo Tsuchiya

AIST, Japan

"Advanced thin films prepared by ultraviolet laser assisted chemical solution processing for electrical and optical applications"

Rudolf Weber

Leiter Verfahrensentwicklung, Institut fur Strahlwerkzeuge (IFSW), Universitat Stuttgart

"Picosecond laser drilling of micro holes in spinnerets for cellulose fibres"

Qiang Wu

Nankai University, China

"Femtosecond laser hyperdoping crystal: Principle and applications"

Haibin Zhang

Technology Development, Electro Scientific Industries, Inc., USA

"Laser based micro fabrication systems for electronics packaging"

[Invited Speakers for Special Sessions]

SS1: Lasers and Nanoparticles in Liquids

David Amans

Universite Claude Bernard Lyon 1, France

"Origin of the nano-carbon allotropes in pulsed laser ablation in liquids synthesis"

Junji Nakamura

Tsukuba Research Center for Interdisciplinary Materials Science (TIMS), University of Tsukuba

"Fuel cell catalysts using graphene"

Toshihiro Nakamura

Faculty of Science and Technology, Gunma University, Japan

"Fabrication of colloidal Si nanoparticles by pulsed-laser irradiation of porous Si in liquid: Toward high productivity and size control"

SS2: Optimisation of laser ablation processes using ultrashort pulse lasers

Stefan Dimov

University of Birmingham, UK

"System level tools for integrating laser micro processing modules in production lines"

Heinz P. Huber

Munich University of Applied Sciences (MUAS), Germany

"Ultrafast laser processing of metals: Comparative studies of experimental and simulated transient optical properties"

John Lopez

Bordeuax University/CNRS, France

"Efficient metal and glass processing using high average power ultrafast laser"

SS3: Laser processes for packaging of high power electronics and energy storage systems

Kazuya Hirata

DISCO Corporation, Japan

"Novel laser slicing technology for SiC, KABRA"

Alexander Olowinsky

Fraunhofer ILT, Germany

"Laser based joining processes for battery assembly and high power electronics - recent results and future applications"

Takeru Hayashi

Kyushu University, Japan

"Laser processing of SiC target with instant surface excitation using femtosecond double pulse beam"

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