LPM Topics
L-01.
Fundamental aspects
(Dynamics, modeling, simulation, etc.)
L-02.
Process monitoring and
control
L-03.
Laser and
photochemistry
L-04.
Nanotechnology
L-05.
Laser-based
direct-write techniques
L-06.
Ultra-short pulse laser
processing
L-07.
VUV laser and X-ray
processing
L-08.
Surface treatment
(Texturing, cleaning, annealing, modification, etc.)
L-09.
Advanced laser
processing (Fiber laser, disc laser, FEL, etc.)
L-10.
Micro-patterning and
micro-structuring
L-11.
Nano ripple formation
L-12.
Micro-machining
L-13.
3-D micro- and
nano-fabrication
L-14.
Drilling and cutting
L-15.
Micro-welding and
micro-bonding
L-16.
Micro-forming
L-17.
Wafer dicing
L-18.
Marking and trimming
L-19.
Glass/Ceramic
processing
L-20.
Packaging and mounting
process
L-21.
Lithography (including
EUV source and application)
L-22.
Manufacture of micro
devices and systems
L-23.
Film deposition and
synthesis of advanced materials (PLD, CVD, etc.)
L-24.
Nano- and
micro-particles
L-25.
Medical and biological
applications
L-26.
Optics and systems for
laser microprocessing
L-27.
Laser devices
L-28.
Beam shaping
L-29.
Industrial applications
L-30.
Others
L-31.
LPM Special Session
(L1) gLaser
synthesis and processing in liquidsh
L-32.
LPM Special Session
(L2) gLaser coloring using short and ultrashort
pulsed lasersh
L-33. LPM Special Session (L3) gLaser processing of glass materials:
current status, trends and futureh
HPL Topics
H-01.
Fundamentals of
laser-materials interactions
H-02.
Laser-induced
plasma/plume
H-03.
Gas laser
H-04.
Solid-state laser (YAG,
Fiber, Disk, etc.)
H-05.
Diode laser
H-06.
Green or blue laser
H-07.
Optics
H-08.
Beam delivery system
H-09.
Monitoring and control
(including OCT)
H-10.
Metallurgical and
mechanical aspects
H-11.
Modeling and simulation
H-12.
Cleaning
H-13.
Surface modification
(Hardening, quenching, alloying, etc.)
H-14.
Cladding and rapid prototyping
H-15.
Additive manufacturing
(3D Printer)
H-16.
Welding
H-17.
Welding of thick plate
H-18.
Welding of high
strength steel
H-19.
Welding of light metals
and alloys
H-20.
Joining of plastics,
glasses or ceramics
H-21.
Joining of dissimilar
materials (Plastic to metal)
H-22.
Joining of battery or
fuel cell
H-23.
Remote welding
H-24.
Hybrid welding
H-25.
Brazing and soldering
H-26.
Drilling (High speed
and high quality)
H-27.
Cutting (of CFRP, etc.)
H-28.
Thick plate cutting and
dismantling
H-29.
Industrial
applications
H-30.
Innovative applications
(Sandwich panel, etc.)
H-31.
Present status and
future prospects
H-32.
Others